FEMC008GTTA7-T13-16

Memory IC Overview

The FEMC008GTTA7-T13-16 is a non-volatile NAND Flash memory IC manufactured by Flexxon Pte Ltd. It utilizes Multi-Level Cell (MLC) technology and adheres to the eMMC interface standard. The device offers a total storage capacity of 64 Gbit, organized as 8G x 8 bits. It operates with a clock frequency of up to 200 MHz and supports a supply voltage range of 2.7V to 3.6V. The component is designed for industrial-grade applications, functioning within an operating temperature range of -40°C to +85°C. It is housed in a 153-FBGA package measuring 11.5x13 mm.

Memory IC Feature Summary

• Industrial-grade reliability with extended temperature tolerance
• High-speed eMMC interface support
• Multi-Level Cell NAND flash architecture

Memory IC Applications

• Data logging devices
• Consumer electronics
• Network infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix codes against official Flexxon documentation to ensure correct speed grade and temperature rating. Confirm RoHS compliance status if required by your manufacturing standards. Check for lifecycle status updates to ensure long-term availability. Ensure the 153-FBGA footprint matches your PCB design constraints. Validate voltage requirements against your system power rails.

Memory IC Selection Notes

Select this component when industrial durability and high-density storage are required in a compact form factor. The eMMC interface simplifies host controller integration compared to raw NAND solutions. Consider the MLC technology for a balance between endurance and cost. Ensure the host system supports the specified voltage range and clock speeds. Verify that the physical dimensions fit within the designated enclosure space.

Memory IC Part Context

This part belongs to Flexxon's industrial NAND flash portfolio, targeting sectors requiring robust data retention under harsh conditions. Flexxon specializes in storage solutions for medical, automotive, and industrial markets. The FEMC series provides standardized interfaces for easier system design. This specific model represents a high-capacity option within their embedded multimedia card lineup.

Memory IC Replacement Considerations

Direct substitutes may include other Flexxon eMMC parts with similar pinouts and capacities, such as variants in the FEMC008 series. Cross-referencing with other manufacturers requires verifying electrical compatibility and interface protocols. Ensure any replacement maintains the same package size and thermal characteristics.