Memory IC FEMC008GTTE7-T13-16 product image

FEMC008GTTE7-T13-16

$25.59
  • Description:IC FLASH 64GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:577bf6f5b11d Category: Brand:

  
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FEMC008GTTE7-T13-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GTTE7-T13-16

  • Description:IC FLASH 64GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC_5
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GTTE7-T13-16

FEMC008GTTE7-T13-16

Memory IC Overview

The FEMC008GTTE7-T13-16 is a NAND flash memory IC utilizing MLC technology, organized as 8G x 8 bits. It implements the eMMC_5 interface with a clock frequency of 200 MHz. The device operates within a supply voltage range of 2.7V to 3.6V and supports an operating temperature range of -40°C to 85°C. It is housed in a 100-FBGA package measuring 14x18 mm.

Memory IC Feature Summary

  • Utilizes MLC NAND technology for balanced performance and endurance
  • Supports eMMC_5 interface protocol for standardized connectivity
  • Operates at high clock frequencies up to 200 MHz
  • Designed for industrial temperature ranges from -40°C to 85°C

Memory IC Applications

  • Industrial embedded systems requiring robust storage
  • Automotive infotainment and control units
  • IoT devices with extended lifecycle requirements
  • Medical equipment data logging
  • HMI and display projects

Memory IC Procurement Notes

Verify authenticity through multi-step inspection processes to mitigate counterfeit risks. Confirm RoHS3 compliance and MSL level 3 handling requirements during procurement. Ensure compatibility with existing controller firmware for optimal sequential throughput and random IOPS performance.

Memory IC Selection Notes

Select this component when eMMC_5 compatibility and industrial temperature stability are required. The 100-FBGA package suits space-constrained designs. Consider the 200 MHz clock speed for applications needing sustained random IOPS. Verify voltage tolerance matches the system power rail specifications.

Memory IC Part Context

This part belongs to Flexxon's eMMC memory series, designed for demanding environments. It complements other variants like the FEMC008GTTE7-T13-17 by offering specific packaging and interface configurations. The XTRA III series focuses on reliability and longevity for critical applications.

Memory IC Replacement Considerations

Check pinout compatibility with 100-FBGA (14x18) footprints. Verify eMMC_5 protocol support in the host controller. Compare MLC endurance ratings against application write cycles. Ensure thermal management aligns with -40°C to 85°C operational limits.

FEMC008GTTE7-T13-16FEMC008GTTE7-T13-16
$25.59
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