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FEMC008GTTE7-T14-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
The FEMC008GTTE7-T14-17 is a NAND (pSLC) Flash memory IC manufactured by Flexxon Pte Ltd. It features a storage capacity of 64Gbit and utilizes an eMMC interface operating at a clock frequency of 200 MHz. The component is housed in a 153-FBGA package with dimensions of 11.5x13 mm. It supports a supply voltage range of 2.7V to 3.6V and functions within a temperature range of -40°C to 85°C.
Verify the specific suffix T14-17 against the datasheet to confirm pinout and electrical characteristics match the design requirements. Ensure the 153-FBGA footprint aligns with the PCB layout. Confirm RoHS3 compliance status if required by regulatory standards. Check for moisture sensitivity level (MSL 3) handling procedures during assembly.
Select this component when high-speed eMMC connectivity is required alongside robust data retention in harsh conditions. The pSLC architecture offers superior write endurance compared to standard SLC or MLC variants. Consider the 200 MHz interface speed for applications demanding rapid sequential throughput and sustained random input/output operations.
This part belongs to the Flexxon XTRA III series, designed for industrial-grade reliability. It shares the same physical package and interface protocol as other models in the series, such as the FEMC002GTTE7-T14-17, but differs in storage capacity and specific firmware optimizations for higher density data handling.
Direct substitutes include other Flexxon eMMC parts in the 153-FBGA package with compatible voltage and temperature ranges. Verify that any replacement maintains the pSLC technology and AES encryption support if security is a critical requirement.
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