Memory IC FEMC008GTTE7-T14-17 product image

FEMC008GTTE7-T14-17

$37.91
  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:6911efcc844d Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

FEMC008GTTE7-T14-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GTTE7-T14-17

  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GTTE7-T14-17

FEMC008GTTE7-T14-17

Memory IC Overview

The FEMC008GTTE7-T14-17 is a NAND (pSLC) Flash memory IC manufactured by Flexxon Pte Ltd. It features a storage capacity of 64Gbit and utilizes an eMMC interface operating at a clock frequency of 200 MHz. The component is housed in a 153-FBGA package with dimensions of 11.5x13 mm. It supports a supply voltage range of 2.7V to 3.6V and functions within a temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Utilizes pSLC NAND technology for enhanced endurance
  • Integrates proprietary controller firmware for sustained random IOPS
  • Supports AES encryption capabilities
  • Includes power loss management features

Memory IC Applications

  • Rigorous industrial environments
  • HMI and display projects
  • External peripheral data storage

Memory IC Procurement Notes

Verify the specific suffix T14-17 against the datasheet to confirm pinout and electrical characteristics match the design requirements. Ensure the 153-FBGA footprint aligns with the PCB layout. Confirm RoHS3 compliance status if required by regulatory standards. Check for moisture sensitivity level (MSL 3) handling procedures during assembly.

Memory IC Selection Notes

Select this component when high-speed eMMC connectivity is required alongside robust data retention in harsh conditions. The pSLC architecture offers superior write endurance compared to standard SLC or MLC variants. Consider the 200 MHz interface speed for applications demanding rapid sequential throughput and sustained random input/output operations.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series, designed for industrial-grade reliability. It shares the same physical package and interface protocol as other models in the series, such as the FEMC002GTTE7-T14-17, but differs in storage capacity and specific firmware optimizations for higher density data handling.

Memory IC Replacement Considerations

Direct substitutes include other Flexxon eMMC parts in the 153-FBGA package with compatible voltage and temperature ranges. Verify that any replacement maintains the pSLC technology and AES encryption support if security is a critical requirement.

FEMC008GTTE7-T14-17FEMC008GTTE7-T14-17
$37.91
Buy Now