FEMC008GTTG7-T13-16

Memory IC Overview

The FEMC008GTTG7-T13-16 is an 8 Gbit (1 GB) NAND Flash memory integrated circuit manufactured by Flexxon Pte Ltd. It utilizes Multi-Level Cell (MLC) technology and conforms to the Embedded Multi-Media Card (eMMC) standard. The device operates at a clock frequency of 200 MHz and is housed in a 100-FBGA package with dimensions of 14x18 mm. This component is designed for high-reliability data storage applications requiring robust industrial-grade performance.

Memory IC Feature Summary

• Integrates MLC NAND flash memory within an eMMC-compliant controller architecture
• Supports high-speed data transfer via a 200 MHz operating interface
• Engineered for industrial environments with extended temperature tolerance
• Utilizes a compact 100-FBGA surface-mount package for space-constrained designs

Memory IC Applications

• Industrial automation control systems
• Medical imaging and diagnostic equipment
• Automotive infotainment and telematics units
• Cybersecurity hardware appliances

Memory IC Procurement Notes

Verify the specific revision suffix and package variant against the official Flexxon datasheet before ordering. Confirm that the 100-FBGA footprint matches your PCB layout requirements. Ensure compatibility with the host controller's eMMC version support. Check for any specific environmental certifications required for your deployment region. Validate lead times as availability may fluctuate due to supply chain constraints.

Memory IC Selection Notes

Select this component when an eMMC interface is preferred over raw NAND or SD cards for simplified host driver integration. Choose this model for applications demanding MLC endurance characteristics within a small form factor. Consider the 200 MHz speed rating for bandwidth-intensive embedded tasks. Evaluate the 14x18 mm package size against available board real estate. Ensure the operating temperature range meets the specific environmental conditions of the target system.

Memory IC Part Context

Flexxon Pte Ltd specializes in industrial-grade NAND flash storage solutions, focusing on reliability and longevity for critical sectors. The FEMC series represents their embedded memory offerings, designed to withstand harsh operating conditions. This part belongs to a line of components tailored for cybersecurity, medical, and automotive industries where data integrity is paramount.

Memory IC Replacement Considerations

Consult Flexxon documentation for direct cross-references. Verify pin-to-pin compatibility if substituting with other FBGA packages. Ensure the replacement supports the same eMMC specification level. Confirm identical capacity and cell type (MLC) to maintain performance parity.