FEMC008GTTG7-T13-17

Memory IC Overview

The FEMC008GTTG7-T13-17 is an 8 Gbit (1 GB) NAND flash memory IC in the eMMC interface format. It utilizes pSLC technology to enhance endurance and data retention compared to standard MLC options. The device operates at a clock frequency of 200 MHz, supporting high-speed data transfer rates suitable for demanding embedded applications. It is housed in a 153-FBGA package with dimensions of 11.5x13 mm, designed for surface-mount assembly. This component integrates a controller firmware optimized for sequential throughput and random IOPS.

Memory IC Feature Summary

• Utilizes proprietary controller firmware to ensure rapid sequential throughput and sustained random IOPS.
• Employs pSLC NAND technology to provide extended endurance and reliability over standard multi-level cell variants.
• Supports high-frequency operation up to 200 MHz for efficient data processing in embedded systems.

Memory IC Applications

• Industrial embedded storage systems requiring high endurance
• Medical devices needing reliable data retention
• Automotive electronics with strict environmental constraints

Memory IC Procurement Notes

Verify the specific suffix T13-17 against your design requirements, as Flexxon uses suffixes to denote package variations or temperature grades. Confirm that the 153-FBGA footprint matches your PCB layout. Ensure compatibility with the host controller's eMMC version support. Check for RoHS compliance status if required by your manufacturing standards. Validate the operating temperature range against your system's thermal environment.

Memory IC Selection Notes

Select this part when pSLC endurance is critical for long-term industrial or automotive deployments. The 200 MHz speed supports high-bandwidth applications where standard eMMC speeds are insufficient. The 153-FBGA package offers a compact solution for space-constrained designs. Consider the 1 GB capacity relative to your firmware and data logging needs. Evaluate the thermal performance within the specified operating range.

Memory IC Part Context

This component belongs to Flexxon's industrial NAND storage portfolio, which focuses on cybersecurity, medical, and automotive sectors. The FEMC series represents their embedded MultiMediaCard solutions designed for harsh environments. Flexxon differentiates its products through proprietary firmware and pSLC/SLC technologies to maximize lifespan and data integrity in mission-critical applications.

Memory IC Replacement Considerations

Check Flexxon datasheets for other FEMC series parts with similar FBGA footprints. Verify pin-to-pin compatibility before substituting. Compare pSLC endurance ratings and operating temperature ranges. Ensure the replacement supports the same eMMC protocol version. Confirm package dimensions match the existing PCB silkscreen and solder mask.

Memory IC FAQ

What type of NAND technology does the FEMC008GTTG7-T13-17 use?

It uses pSLC (pseudo-Single Level Cell) NAND technology, which offers higher endurance and better data retention than standard MLC NAND.

What is the maximum operating clock frequency for this eMMC device?

The device supports a clock frequency of up to 200 MHz, enabling high-speed data transfers.

What is the physical package type for this component?

It is housed in a 153-FBGA package with dimensions of 11.5x13 mm.