Memory IC FEMC008GTTG7-T14-17 product image

FEMC008GTTG7-T14-17

$25.06
  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:099ba8ea1c4d Category: Brand:

  
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FEMC008GTTG7-T14-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GTTG7-T14-17

  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GTTG7-T14-17

FEMC008GTTG7-T14-17

Memory IC Overview

The FEMC008GTTG7-T14-17 is an embedded multimedia card (eMMC) memory device manufactured by Flexxon Pte Ltd. It features a memory organization of 8G x 8 bits and utilizes an eMMC interface with a clock frequency of 200 MHz. The component operates within a supply voltage range of 2.7V to 3.6V and supports an operating temperature range starting from -25°C. Key functional attributes include hardware encryption, ECC error correction, and software write protection capabilities.

Memory IC Feature Summary

  • Hardware encryption function for data security
  • ECC error correction capability
  • Software write protection function

Memory IC Applications

  • Embedded communication applications
  • Industrial storage solutions
  • Harsh environment critical systems

Memory IC Procurement Notes

Verify the specific operating temperature grade against project requirements, as sources indicate -25°C while industrial variants often require -40°C. Confirm package compatibility with FBGA-153 footprints. Ensure design tools support the eMMC protocol at 200 MHz. Cross-reference datasheet revisions to confirm feature availability.

Memory IC Selection Notes

Select this component when hardware encryption and ECC are mandatory for data integrity in embedded environments. Evaluate thermal management needs given the specified operating temperature limits. Compare against other Flexxon eMMC series if wider temperature ranges or different interface speeds are required for the target application.

Memory IC Part Context

This part belongs to the Flexxon FEMC series of embedded flash memory devices. These components are designed for rugged and high-performance storage in critical applications. The series typically integrates NAND flash with a controller to provide reliable data retention and access in demanding conditions.

Memory IC Replacement Considerations

FEMC008GTTE7-T14-17 is listed in programmer databases for similar FBGA153 packages. Verify electrical specifications and pinout compatibility before substitution. No direct public substitute is confirmed; consult manufacturer for qualified alternatives.

FEMC008GTTG7-T14-17FEMC008GTTG7-T14-17
$25.06
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