Memory IC FEMC016G-M12 product image

FEMC016G-M12

$14.22
  • Description:IC FLSH 128GBIT EMMC 5.1 153FBGA
  • Series:ECON II
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:e19005b6cad7 Category: Brand:

  
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FEMC016G-M12 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 128GBIT EMMC 5.1 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC016G-M12

  • Description:IC FLSH 128GBIT EMMC 5.1 153FBGA
  • Series:ECON II
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:128Gbit
  • Memory Organization:16G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC016G-M12

FEMC016G-M12

Memory IC Overview

The FEMC016G-M12 is a 128 Gbit (16 GB) MLC NAND flash memory component from the Flexxon ECON II series. It features an eMMC 5.1 interface and operates at a clock frequency of 200 MHz. The device utilizes a Surface Mount mounting type within an FBGA-153 package. Its specified operating temperature range extends from -25°C to 85°C, supporting embedded communication applications with stable integration.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 standard for embedded flash storage
  • Utilizes MLC NAND technology for non-volatile data retention
  • Supports rapid data transfer via 200 MHz clock frequency

Memory IC Applications

  • Embedded communication systems
  • Industrial control modules
  • Consumer electronics storage

Memory IC Procurement Notes

Verify current availability status as the component may be discontinued at major distributors. Confirm package integrity and pin compatibility before integration. Ensure supply chain sources provide authentic Flexxon Pte Ltd products to guarantee reliability in industrial environments.

Memory IC Selection Notes

Select this component for applications requiring eMMC 5.1 compliance and wide temperature operation. Consider the 16 GB capacity and MLC endurance characteristics against project requirements. Validate that the FBGA-153 footprint matches the target PCB design constraints.

Memory IC Part Context

This part belongs to the Flexxon ECON II series, designed for cost-effective embedded storage solutions. It integrates a controller with NAND flash to simplify host system design. The series targets industries needing reliable non-volatile memory with standardized interfaces.

Memory IC Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

FEMC016G-M12FEMC016G-M12
$14.22
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