FEMC016GBA-T740

Memory IC Overview

The FEMC016GBA-T740 is a 16GB embedded MultiMediaCard (eMMC) manufactured by Flexxon Pte Ltd. This component integrates flash memory and a controller within a single package, designed for high-performance data storage in mobile and industrial applications. It supports the eMMC standard, offering reliable read/write operations and power efficiency. The device features a low-profile form factor suitable for space-constrained designs.

Memory IC Feature Summary

• Integrated flash memory and controller for simplified system design
• High-speed data transfer capabilities compliant with eMMC standards
• Low power consumption optimized for battery-operated devices

Memory IC Applications

• Mobile phones and tablets
• Industrial control systems
• Automotive infotainment units

Memory IC Procurement Notes

Verify the specific revision level and packaging details directly with Flexxon Pte Ltd or authorized distributors before procurement. Ensure compatibility with the target host controller interface requirements. Request official datasheets to confirm electrical characteristics and mechanical dimensions for your specific application needs.

Memory IC Selection Notes

Select this component when a compact, integrated storage solution is required for mobile or embedded systems. Consider the 16GB capacity and eMMC interface compatibility with your existing hardware platform. Evaluate power management requirements against the device's specifications to ensure optimal system performance and battery life.

Memory IC Part Context

This part belongs to Flexxon's embedded storage portfolio, targeting markets requiring robust, non-volatile memory solutions. It complements other eMMC offerings by providing a balance of capacity and performance. The product line focuses on reliability and longevity for demanding environments.

Memory IC Replacement Considerations

Check for direct substitutes from Flexxon with identical pinouts and electrical specs. Verify if alternative vendors offer compatible eMMC packages with matching capacity and interface speeds. Ensure any replacement maintains the same form factor and thermal characteristics.