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FEMC016GBE-T740 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 128GBIT EMMC 5.1 153FBGA. Review the specifications below when checking this part for your BOM.
The FEMC016GBE-T740 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It features a storage capacity of 16 Gb with an organization of 2G x 8 bits, utilizing TLC technology. The device complies with the JEDEC eMMC 5.1 standard and operates at a clock frequency up to 200 MHz. It supports data bus widths of 1-bit, 4-bit, and 8-bit. The IC is housed in a 153-pin FBGA package measuring 11.5x13 mm. Operating voltage ranges from 2.7V to 3.6V, and it functions within a temperature range of -40°C to 85°C.
Verify the specific suffix T740 against official Flexxon documentation to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with the host controller's eMMC interface version. Confirm availability through authorized distributors as supply levels may fluctuate. Check RoHS compliance status for regulatory adherence in target markets.
Select this component when a compact 16 Gb storage solution is required for space-constrained designs. The 153-pin FBGA package suits surface-mount applications. Consider the 200 MHz clock speed and multi-width bus support for performance needs. Verify that the operating temperature range meets environmental conditions. Ensure the host system supports eMMC 5.1 protocols for optimal functionality.
This part belongs to Flexxon's XTRA VII series of eMMC flash memories. It combines an embedded flash controller with NAND flash in a single JEDEC standard package. The series emphasizes high performance, reliability, and advanced power management suitable for portable and embedded applications.
It supports 1-bit (default), 4-bit, and 8-bit data bus widths.
Yes, the device supports field firmware updates and power-off notifications.
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