FEMC016GSTE9-T13-26

$23.38

Description：IC FLASH 128GBIT EMMC 100FBGA
Series：XTRA III
Mfr：Flexxon Pte Ltd
Package：Tray

SKU:827f2b89538f Category: Memory IC Brand: Flexxon Pte Ltd

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Product introduction

FEMC016GSTE9-T13-26 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 128GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC016GSTE9-T13-26

Description：IC FLASH 128GBIT EMMC 100FBGA
Series：XTRA III
Mfr：Flexxon Pte Ltd
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (MLC)
Memory Size：128Gbit
Memory Organization：16G x 8
Memory Interface：eMMC_5.1
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：100-LBGA
Supplier Device Package：100-FBGA (14x18)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FEMC016GSTE9-T13-26

FEMC016GSTE9-T13-26

Memory IC Overview

The FEMC016GSTE9-T13-26 is an industrial-grade embedded multimedia card (eMMC) from Flexxon’s XTRA III series, compliant with JEDEC eMMC 5.1 standards. It utilizes MLC NAND flash technology with a memory organization of 16G x 8 bits. The device operates within a supply voltage range of 2.7V to 3.6V and supports clock frequencies up to 200 MHz. Designed for robust performance, it functions reliably across an extended operating temperature range of -40°C to 85°C (TA).

Memory IC Feature Summary

Complies with JEDEC eMMC 5.1 standard specifications.
Utilizes Multi-Level Cell (MLC) NAND flash technology.
Engineered for industrial-grade reliability and durability.

Memory IC Applications

Industrial control systems requiring stable non-volatile storage.
Embedded devices operating in extreme temperature environments.
Automotive electronics and infotainment modules.

Memory IC Procurement Notes

Verify the specific suffix T13-26 against official Flexxon documentation to confirm package type and temperature grade. Ensure compatibility with host controllers supporting eMMC 5.1 interfaces. Confirm that the 2.7V to 3.6V supply voltage aligns with your system design requirements before procurement.

Memory IC Selection Notes

Select this component when industrial temperature stability (-40°C to 85°C) and eMMC 5.1 compliance are mandatory. Consider the 16G x 8 organization and MLC NAND characteristics for cost-effective high-density storage needs. Validate interface compatibility with existing embedded controllers to ensure seamless integration into the target hardware architecture.

Memory IC Part Context

This part belongs to Flexxon’s XTRA III series, which focuses on industrial and automotive memory solutions. Flexxon Pte Ltd specializes in designing and manufacturing reliable NAND flash products for demanding applications. The series emphasizes longevity and performance consistency under harsh environmental conditions compared to commercial-grade alternatives.

Memory IC Replacement Considerations

Consult official Flexxon substitution guides for verified equivalents. Generic eMMC replacements may not match the specified industrial temperature range or MLC endurance profiles. Verify pinout and electrical parameters carefully to avoid functional mismatches in embedded designs.