FEMC016GSTE9-T14-26

Memory IC Overview

The FEMC016GSTE9-T14-26 is an industrial-grade eMMC 5.1 flash memory device from Flexxon's XTRA III series, designed for robust data storage in demanding environments. It features a 16 Gbit capacity utilizing MLC NAND technology within a non-volatile memory structure. The component operates with a clock frequency of 200 MHz and supports a supply voltage range of 2.7V to 3.6V. It is engineered for surface mount installation in a 153-pin VFBGA package. The device maintains reliable performance across an extended operating temperature range of -40°C to 85°C (TA), ensuring stability for industrial applications requiring high durability and compliance with JEDEC standards.

Memory IC Feature Summary

• Complies fully with the JEDEC eMMC 5.1 standard for standardized interface communication
• Utilizes MLC NAND technology for balanced endurance and density in industrial settings
• Engineered for wide temperature operation ranging from -40°C to 85°C ambient
• Integrates embedded controller and NAND flash into a single compact package

Memory IC Applications

• Industrial automation controllers requiring reliable non-volatile storage
• Embedded systems operating in extreme temperature environments
• IoT devices needing durable flash memory solutions
• Automotive electronics subject to vibration and thermal stress

Memory IC Procurement Notes

Verify the specific ordering suffix matches the required package and temperature grade. Confirm that the 153-pin VFBGA footprint aligns with your PCB design constraints. Ensure the 2.7V to 3.6V supply voltage is compatible with your system power rails. Check for any specific RoHS or REACH compliance documentation required for your region. Validate the active status of the part number through official Flexxon channels before finalizing procurement.

Memory IC Selection Notes

Select this component when industrial reliability and wide temperature tolerance are critical. The eMMC 5.1 interface simplifies integration compared to discrete NAND solutions. Consider the 16 Gbit capacity against your storage requirements. The MLC technology offers a balance between cost and endurance suitable for moderate write cycles. Ensure your host controller supports the eMMC protocol and the 200 MHz clock speed.

Memory IC Part Context

This part belongs to Flexxon's XTRA III series, which focuses on industrial-grade memory solutions. Flexxon Pte Ltd specializes in designing and manufacturing high-performance NAND flash products. The company emphasizes reliability and security for applications where standard consumer-grade components may fail. This series is distinct from their automotive or commercial lines by its specific temperature and endurance ratings.

Memory IC Replacement Considerations

Direct replacements must match the 153-pin VFBGA package and eMMC 5.1 interface. Verify that substitute parts support the same 2.7V to 3.6V voltage range and -40°C to 85°C temperature rating. Capacity and MLC technology should be equivalent to ensure functional compatibility. Consult Flexxon for authorized cross-reference lists to guarantee quality and availability.