Memory IC FEMC016GTTA7-T13-16 product image

FEMC016GTTA7-T13-16

$25.47
  • Description:IC FLASH 128GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:3f6cfe12296f Category: Brand:

  
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FEMC016GTTA7-T13-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 128GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC016GTTA7-T13-16

  • Description:IC FLASH 128GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:128Gbit
  • Memory Organization:16G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC016GTTA7-T13-16

FEMC016GTTA7-T13-16

Memory IC Overview

The FEMC016GTTA7-T13-16 is a non-volatile NAND flash memory IC manufactured by Flexxon Pte Ltd. It features a 128 Gbit capacity organized as 16G x 8 bits, utilizing Multi-Level Cell (MLC) technology. The device supports the eMMC interface with a maximum clock frequency of 200 MHz. It operates within a voltage range of 2.7V to 3.6V and is housed in a 100-FBGA package measuring 14x18 mm. The component is rated for an extended operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Integrates hardware encryption engine and embedded security software for data protection
  • Supports wide operating voltage range suitable for diverse power environments
  • Utilizes MLC NAND technology for high-density storage

Memory IC Applications

  • Industrial control systems requiring robust data retention
  • Automotive electronics operating in extreme temperatures
  • Embedded multimedia cards in consumer devices

Memory IC Procurement Notes

Verify the specific suffix T13-16 against official Flexxon documentation to confirm package dimensions and thermal ratings. Ensure compatibility with host controllers supporting eMMC standards at 200 MHz. Confirm voltage requirements align with system design specifications before integration.

Memory IC Selection Notes

Select this component when high-density storage is required alongside hardware-level security features. The extended temperature range makes it suitable for harsh environments where standard commercial parts may fail. Verify that the host system supports the 100-FBGA footprint and eMMC protocol.

Memory IC Part Context

This part belongs to the XTRA III series from Flexxon, designed for industrial and automotive applications. It represents a high-capacity solution within the company's eMMC portfolio, focusing on reliability and security for critical data storage needs in demanding operational conditions.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult Flexxon technical support for direct equivalents or pin-compatible alternatives that meet the same electrical and mechanical specifications.

FEMC016GTTA7-T13-16FEMC016GTTA7-T13-16
$25.47
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