FEMC016GTTE7-T14-16

Memory IC Overview

The FEMC016GTTE7-T14-16 is a 128Gbit NAND Flash memory IC from the Flexxon XTRA III series, utilizing an eMMC interface. It operates at a clock frequency of 200 MHz and supports a supply voltage range of 2.7V to 3.6V. The device employs MLC NAND technology and is housed in a 153-FBGA package measuring 11.5x13 mm. It is designed for industrial applications with a specified operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

• High-density 128Gbit storage capacity using MLC NAND technology
• Industrial-grade reliability with extended temperature range support
• Standard eMMC interface for simplified system integration

Memory IC Applications

• Industrial control systems
• Automotive electronics
• Embedded computing platforms

Memory IC Procurement Notes

Verify the specific suffix (e.g., -16) against official Flexxon documentation to confirm MLC configuration and exact electrical characteristics. Ensure compatibility with host controller eMMC versions. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process before ordering.

Memory IC Selection Notes

Select this component when high density and industrial durability are required. Compare MLC endurance against pSLC alternatives if write cycles are critical. Verify that the 153-FBGA footprint matches the PCB design. Check if the 200 MHz speed meets system bandwidth needs.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series, which focuses on industrial-grade embedded multimedia card solutions. The series offers various capacities and NAND types to suit different performance and longevity requirements in harsh environments.

Memory IC Replacement Considerations

Check Flexxon datasheets for direct substitutes within the FEMC016GTTE7 family. Verify pinout and electrical compatibility before considering non-Flexxon equivalents.