FEMC016GTTE7-T14-29

Memory IC Overview

The FEMC016GTTE7-T14-29 is a NAND flash memory IC utilizing pSLC technology, offering a storage capacity of 128 Gbit organized as 16G x 8. It features an eMMC interface with a clock frequency of 200 MHz and operates within a supply voltage range of 2.7V to 3.6V. The component is housed in a 153-FBGA package measuring 11.5x13 mm, designed for surface mount installation. It supports a wide operating temperature range from -40°C to 85°C and complies with RoHS3 standards.

Memory IC Feature Summary

• Utilizes pSLC NAND technology for enhanced endurance and data retention compared to standard SLC or MLC variants.
• Integrates an eMMC interface for simplified host controller connectivity and standardized command sets.
• Designed for stable operation in harsh environments with extended industrial temperature ratings.

Memory IC Applications

• Industrial control systems requiring reliable non-volatile storage.
• Automotive electronics demanding high durability and temperature resistance.
• Embedded communication devices needing stable integration with existing software tools.

Memory IC Procurement Notes

Verify the specific suffix T14-29 against official Flexxon documentation to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with the host system's eMMC controller version and voltage levels before procurement. Cross-reference the datasheet for moisture sensitivity level (MSL 3) handling procedures during assembly.

Memory IC Selection Notes

Select this component when high endurance and long-term data integrity are critical for embedded applications. The pSLC architecture provides a balance between cost and reliability suitable for industrial and automotive sectors. Consider the 128 Gbit capacity and 200 MHz interface speed to ensure sufficient performance for the target application's data throughput needs.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series of eMMC flash memory solutions. It is manufactured by Flexxon Pte Ltd, a provider of rugged and high-performance storage solutions for critical applications. The product line focuses on delivering robust storage components capable of withstanding harsh environmental conditions while maintaining high data integrity.

Memory IC Replacement Considerations

Check Flexxon datasheets for compatible parts within the same series, such as FEMC016GTTE7-T14-16 or FEMC016GTTE7-T14-18, ensuring identical package dimensions and electrical specifications. Verify that any substitute maintains the same pSLC technology and eMMC interface compliance.