FEMC016GTTG7-T13-27

Memory IC Overview

The FEMC016GTTG7-T13-27 is a NAND (pSLC) Memory IC from Flexxon Pte Ltd, offering a storage capacity of 128 Gbit. It utilizes the eMMC interface and operates at a clock frequency of up to 200 MHz. The component is housed in a 100-FBGA package with dimensions of 14x18 mm. Designed for industrial applications, it supports high-speed data transfer protocols compliant with JEDEC standards.

Memory IC Feature Summary

• Combines embedded flash controller with standard NAND flash memory in a single JEDEC standard package
• Supports field firmware updates and power-off notification capabilities
• Provides advanced power management suitable for low-power electronic devices

Memory IC Applications

• Industrial electronic devices requiring robust storage solutions
• Medical equipment needing reliable data retention
• Automotive sector applications demanding high durability

Memory IC Procurement Notes

Verify the specific ordering suffix and temperature grade against official Flexxon documentation before purchase. Confirm RoHS compliance status and lead times directly with authorized distributors. Ensure the 100-FBGA footprint matches your PCB design requirements. Check for any recent revisions to the datasheet that may affect pinout or electrical characteristics.

Memory IC Selection Notes

Select this component when a pSLC NAND configuration is required for enhanced endurance compared to standard TLC or MLC options. The 128 Gbit capacity offers a balance between density and cost for mid-range industrial applications. Consider the 200 MHz clock speed if higher throughput is necessary within the eMMC protocol constraints. Evaluate the 100-FBGA package size for space-constrained designs.

Memory IC Part Context

This part belongs to the XTRA series of eMMC flash memories from Flexxon. These components are engineered for harsh environments, distinguishing them from consumer-grade storage. The pSLC mode ensures longer write cycles and better data integrity than multi-level cell alternatives, making it suitable for critical infrastructure and long-life deployment scenarios.

Memory IC Replacement Considerations

Direct substitutes must match the 128 Gbit capacity, eMMC 5.1 compatibility, and 100-FBGA (14x18) package. Verify that alternative parts support pSLC operation and similar thermal ranges. Cross-reference pinouts carefully as FBGA packages can have subtle differences even among identical capacities.