FEMC032G-M12

Memory IC Overview

The Flexxon FEMC032G-M12 is an ECON II series embedded multimedia card (eMMC) compliant with the JEDEC eMMC 5.1 standard. It utilizes 3D TLC NAND flash technology with a total capacity of 32 GB (256 Gbit). The device features a memory organization of 32G x 8 and operates with a clock frequency of 200 MHz. It supports a supply voltage range of 2.7V to 3.6V. The component is available in a 153-FBGA package measuring 11.5x13 mm. Operating temperature specifications vary by source, ranging from -25°C to 85°C or -40°C to 105°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 standard for embedded storage
• Integrates 3D TLC NAND flash memory for high density
• Supports advanced power management capabilities
• Designed for small form factor electronic devices

Memory IC Applications

• Small electronic devices requiring embedded storage
• Low power consumer electronics
• Industrial control systems
• Portable computing hardware

Memory IC Procurement Notes

Verify the specific operating temperature grade required for your application, as documentation references both commercial (-25°C to 85°C) and industrial (-40°C to 105°C) ranges. Confirm the exact package dimensions and pinout compatibility with your PCB layout. Ensure supply voltage requirements align with the 2.7V to 3.6V specification. Cross-reference the manufacturer's latest datasheet for any revisions to the ECON II series specifications before finalizing procurement.

Memory IC Selection Notes

Select this component when a JEDEC eMMC 5.1 interface is required for embedded applications. The 32 GB capacity suits systems needing moderate storage within a compact footprint. Consider the 153-FBGA package constraints during mechanical design. Evaluate thermal management needs based on the intended operating temperature range, ensuring the selected variant matches the environmental conditions of the end product.

Memory IC Part Context

This part belongs to Flexxon's ECON II series of embedded flash memory solutions. The series focuses on providing reliable storage for embedded systems. The FEMC032G-M12 specifically targets applications demanding a balance between performance, reliability, and power efficiency. It integrates the controller and NAND flash into a single package, simplifying system design compared to discrete memory solutions.

Memory IC Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing system controllers before considering alternative vendors. Check if other Flexxon models in the ECON II series offer different capacities or temperature grades that might fit the design requirements.