FEMC032GBA-T740

Memory IC Overview

The FEMC032GBA-T740 is a 3D TLC NAND flash memory device from the XTRA VII series, manufactured by Flexxon Pte Ltd. It complies with the JEDEC eMMC 5.1 standard and integrates an embedded flash controller with NAND memory in a single package. The component features a 256 Gbit capacity (32 GB) organized as 32G x 8 bits. It operates within a clock frequency range of 0 to 200 MHz and supports data bus widths of 1-bit, 4-bits, and 8-bits. The device utilizes a 153-pin FBGA surface-mount package and functions across a temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 specification for standardized interface compatibility
• Integrates embedded flash controller with 3D TLC NAND for high reliability
• Supports field firmware updates and power-off notification mechanisms

Memory IC Applications

• Industrial automation systems requiring robust storage
• Medical electronic devices demanding high reliability
• Automotive embedded applications

Memory IC Procurement Notes

Verify the specific part number suffix against official Flexxon documentation to confirm pinout and electrical characteristics. Ensure the procurement channel provides valid RoHS compliance certificates. Confirm that the supplier can support the required industrial temperature grade specifications for your deployment environment.

Memory IC Selection Notes

Select this component when a JEDEC-compliant eMMC interface is required for embedded storage. Consider the 153-pin FBGA package constraints for PCB layout. Evaluate the need for 3D TLC technology versus other NAND types based on endurance requirements. Verify that the host controller supports the eMMC 5.1 protocol and the specified clock frequencies.

Memory IC Part Context

This model belongs to the XTRA VII series of industrial-grade NAND flash memories. Flexxon specializes in hardware-based cybersecurity solutions and rugged storage for critical sectors. The series emphasizes advanced power management and reliability for harsh environments, distinguishing it from consumer-grade equivalents through extended temperature ranges and enhanced durability.

Memory IC Replacement Considerations

Direct substitutes must match the 153-pin FBGA package and eMMC 5.1 interface. Verify capacity equivalence at 32 GB (256 Gbit). Ensure the replacement supports the same 1-bit, 4-bit, and 8-bit bus width configurations and operates within the -40°C to 85°C temperature range.