FEMC032GBB-T740

Memory IC Overview

The FEMC032GBB-T740 is a non-volatile flash memory component from Flexxon's XTRA VIII series, utilizing 3D TLC NAND technology. It features a storage capacity of 256 Gbit (32G x 8 bits) and complies with the JEDEC eMMC 5.1 standard. The device integrates an embedded flash controller within a 153-pin FBGA package measuring 11.5x13 mm. It supports clock frequencies up to 200 MHz and offers data bus widths of 1-bit, 4-bit, or 8-bit.

Memory IC Feature Summary

• Compliance with JEDEC eMMC 5.1 specification for standardized interface compatibility
• Integration of embedded flash controller with 3D TLC NAND memory in a single package
• Support for high-speed data transfer via configurable bus widths

Memory IC Applications

• Embedded systems requiring reliable non-volatile storage
• Portable electronic devices with space constraints
• Industrial control units needing robust data retention

Memory IC Procurement Notes

Verify the specific revision level against the manufacturer's latest documentation before integration. Confirm that the 153-FBGA footprint matches the target PCB design. Ensure power supply requirements align with the eMMC 5.1 electrical specifications. Check for any updated firmware recommendations to maintain optimal performance and reliability during deployment.

Memory IC Selection Notes

Select this component when a compact, high-density storage solution is required for embedded applications. The 153-pin FBGA package suits designs with limited board space. Consider the 3D TLC NAND technology for cost-effective high-capacity needs while ensuring the host system supports eMMC 5.1 protocols and voltage levels compatible with the device.

Memory IC Part Context

This part belongs to Flexxon's XTRA VIII series of embedded MultiMediaCards. The series focuses on providing high-performance, reliable flash storage solutions for demanding environments. The FEMC032GBB-T740 variant specifically targets applications requiring 32GB capacity with industrial-grade durability and standard interface compatibility.

Memory IC Replacement Considerations

Direct substitutes include other eMMC 5.1 components with identical 153-FBGA footprints and 32GB capacity. Verify pin-to-pin compatibility and electrical characteristics before swapping. Alternative Flexxon models within the same series may offer different endurance ratings or temperature ranges.