FEMC032GBE-T740

$13.71

Description：IC FLSH 256GBIT EMMC 5.1 153FBGA
Series：XTRA VII
Mfr：Flexxon Pte Ltd
Package：Tray

SKU:a16478045cb7 Category: Memory IC Brand: Flexxon Pte Ltd

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Product introduction

FEMC032GBE-T740 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 256GBIT EMMC 5.1 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC032GBE-T740

Description：IC FLSH 256GBIT EMMC 5.1 153FBGA
Series：XTRA VII
Mfr：Flexxon Pte Ltd
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (TLC)
Memory Size：256Gbit
Memory Organization：32G x 8
Memory Interface：eMMC_5.1
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FEMC032GBE-T740

FEMC032GBE-T740

Memory IC Overview

The FEMC032GBE-T740 is a 32 Gbit (4 GB) eMMC flash memory from the XTRA VII series by Flexxon Pte Ltd. It complies with JEDEC eMMC 5.1 standards and integrates an embedded flash controller with NAND flash in a 153-ball FBGA package. The device supports clock frequencies up to 200 MHz and data bus widths of 1, 4, or 8 bits. Operating voltage ranges from 2.7 V to 3.6 V, with a temperature range of -40°C to 85°C.

Memory IC Feature Summary

Complies with JEDEC eMMC 5.1 standard for high-speed protocol support
Integrates embedded flash controller with NAND flash memory
Supports field firmware updates and power-off notification

Memory IC Applications

Embedded communication systems
Industrial USB flash drives
Military system storage

Memory IC Procurement Notes

Verify component authenticity through authorized Flexxon channels. Confirm datasheet version matches procurement requirements. Check RoHS compliance status prior to integration. Ensure supply chain stability for industrial-grade components.

Memory IC Selection Notes

Select this model for applications requiring eMMC 5.1 compatibility and wide temperature operation. Consider 153-ball FBGA package constraints during PCB layout. Evaluate power management features for low-power device integration.

Memory IC Part Context

Part of Flexxon's XTRA VII series, designed for industrial and ruggedized environments. Offers enhanced reliability compared to consumer-grade NAND solutions. Suitable for critical applications requiring stable performance under harsh conditions.