FEMC032GBE-TC40

Memory IC Overview

The FEMC032GBE-TC40 is a 32GB eMMC flash memory device from Flexxon Pte Ltd, utilizing TLC NAND technology. It complies with the JEDEC eMMC 5.1 standard and integrates an embedded flash controller with standard NAND flash in a 153-VFBGA package. The component operates within a voltage range of 2.7V to 3.6V and supports a clock frequency up to 200MHz. It offers data bus widths of 1-bit, 4-bit, or 8-bit and functions reliably across an operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 standard for high-speed protocol communication
• Integrates embedded flash controller with TLC NAND memory in a single package
• Supports field firmware updates and power-off notification capabilities
• Provides advanced power management suitable for low-power electronic devices

Memory IC Applications

• Small electronic devices requiring compact storage solutions
• Low-power consumer electronics
• Embedded systems needing reliable NAND flash integration

Memory IC Procurement Notes

Verify the specific suffix TC40 against official Flexxon documentation to confirm the exact temperature grade and package variant. Ensure compatibility with host controllers supporting eMMC 5.1 specifications. Confirm surface-mount requirements align with PCB design constraints for the 153-VFBGA footprint before ordering.

Memory IC Selection Notes

Select this component when a robust, industry-standard eMMC solution is required for embedded applications. The 153-pin FBGA package suits space-constrained designs. Verify that the host system supports the necessary voltage levels and clock frequencies. Consider the TLC technology characteristics regarding endurance and performance relative to MLC alternatives if higher durability is needed.

Memory IC Part Context

This part belongs to Flexxon's XTRA VII series of eMMC flash memories. It is designed to replace older storage interfaces in modern portable and embedded devices. The series emphasizes reliability and power efficiency, targeting markets where standard NAND flash performance and form factor are critical for system integration.

Memory IC Replacement Considerations

Check for direct substitutes within the same series, such as FEMC064GBE-T740, ensuring pin compatibility and interface standards match. Verify that any replacement maintains the required operating temperature range and voltage specifications for the target application environment.