FEMC032GBG-T340

Memory IC Overview

The FEMC032GBG-T340 is a non-volatile NAND flash memory IC from the Flexxon XTRA V series. It features a 32 Gbit (4 GB) capacity organized as 4G x 8 bits. The device complies with the JEDEC eMMC 5.1 standard and utilizes a 153-pin FBGA package for surface mount applications. It operates within a voltage range of 2.7V to 3.6V and supports clock frequencies up to 200 MHz. The component is designed for low-power electronic devices, offering high performance and reliability through an embedded flash controller.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 standard for standardized interface compatibility
• Integrates embedded flash controller with 3D TLC NAND memory in a single package
• Supports multiple data bus widths including 1-bit, 4-bit, and 8-bit modes
• Enables field firmware updates and power-off notification capabilities

Memory IC Applications

• Small, low-power electronic devices
• Embedded storage systems requiring high reliability
• Portable consumer electronics

Memory IC Procurement Notes

Verify the specific suffix T340 against official Flexxon documentation to confirm pinout and thermal specifications. Ensure the ordering part number matches the required eMMC version and package type. Confirm RoHS compliance status directly with the manufacturer or authorized distributor before procurement. Cross-reference the datasheet revision date to ensure access to the latest technical parameters and electrical characteristics.

Memory IC Selection Notes

Select this component when a compact, high-density storage solution is required for portable applications. The 153-pin FBGA package suits space-constrained designs. Verify that the host system supports eMMC 5.1 protocols and can handle the specified voltage ranges. Consider the operating temperature range if the device will be used in environments outside standard commercial limits.

Memory IC Part Context

This part belongs to the Flexxon XTRA V series of eMMC flash memories. It represents a scalable memory solution designed for diverse industries. The series combines robust performance with advanced power management features. The component is manufactured by Flexxon Pte Ltd, utilizing Taiwan-based production processes for the final assembly stages.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult Flexxon technical support for direct replacements or compatible alternatives within the XTRA series. Ensure any substitute maintains the same 153-pin FBGA footprint and eMMC 5.1 protocol support.