ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
FEMC032GCG-T340 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 256GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMC032GCG-T340
- Description：IC FLASH 256GBIT EMMC 153FBGA
- Series：XTRA V
- Mfr：Flexxon Pte Ltd
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMC032GCG-T340
Memory IC Overview
The FEMC032GCG-T340 is a 256 Gbit eMMC flash memory device manufactured by Flexxon Pte Ltd. It features a clock frequency of 200 MHz and operates within a supply voltage range of 2.7V to 3.6V. The component is designed for surface mount installation in a 153 FBGA package. It supports an operating temperature range from -25°C to 85°C, suitable for industrial applications.
Memory IC Feature Summary
- Industrial-grade NAND flash storage solution
- eMMC interface for high-speed data handling
- Wide operating temperature range
Memory IC Applications
- Industrial sector storage
- Medical device memory
- Automotive electronics
Memory IC Procurement Notes
Verify the manufacturer as Flexxon Pte Ltd and confirm the part number FEMC032GCG-T340 matches the required specifications. Ensure the package type is 153 FBGA and the voltage range aligns with system requirements. Check for active status and original packaging integrity upon receipt.
Memory IC Selection Notes
Select this component for applications requiring robust industrial NAND flash performance. Consider the 200 MHz clock speed and wide temperature tolerance (-25°C to 85°C) for demanding environments. The eMMC interface simplifies integration compared to raw NAND solutions.
Memory IC Part Context
Flexxon specializes in industrial NAND flash storage for industrial, medical, and automotive sectors. This eMMC device is part of their portfolio designed for reliability in harsh conditions. The 153 FBGA package facilitates compact design in embedded systems.
Memory IC Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing board designs before considering alternatives.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
