ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
FEMC032GTTE7-T13-26 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 256GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMC032GTTE7-T13-26
- Description：IC FLASH 256GBIT EMMC 100FBGA
- Series：XTRA III
- Mfr：Flexxon Pte Ltd
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：100-LBGA
- Supplier Device Package：100-FBGA (14x18)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMC032GTTE7-T13-26
Memory IC Overview
The FEMC032GTTE7-T13-26 is a 256Gbit NAND Flash memory IC in the eMMC format, manufactured by Flexxon Pte Ltd. It operates at a clock frequency of 200 MHz and is housed in a 100-FBGA package with dimensions of 14x18 mm. The component supports MLC technology and includes hardware encryption, ECC error correction, and software write protection functions.
Memory IC Feature Summary
- Integrates hardware encryption for data security
- Includes ECC error correction for reliability
- Supports software-based write protection
Memory IC Applications
- Embedded communication systems
- Medical devices
- Automotive electronics
Memory IC Procurement Notes
Verify the exact part number against official Flexxon documentation to ensure compatibility with your system requirements. Confirm that the 100-FBGA package dimensions and pinout match your PCB layout specifications before procurement.
Memory IC Selection Notes
Select this component when mission-critical embedded storage requires integrated security features like hardware encryption and error correction. Ensure the design supports the 200 MHz interface speed and accommodates the specific FBGA footprint.
Memory IC Part Context
This eMMC device belongs to Flexxon's industrial-grade NAND flash portfolio, targeting sectors such as automotive, medical, and industrial automation where reliability and data integrity are paramount.
Memory IC Replacement Considerations
No public confirmed substitute part numbers are available in the provided source material.
Memory IC FAQ
What type of NAND technology does this IC use?
It uses Multi-Level Cell (MLC) NAND technology.
Does the FEMC032GTTE7-T13-26 support error correction?
Yes, it includes an ECC error correction function.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
