FEMC064GBA-E530

Memory IC Overview

The FEMC064GBA-E530 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It complies with the JEDEC eMMC 5.1 standard and utilizes TLC NAND technology. The device features an embedded flash controller within a single package, offering a storage capacity of 64 Gbit (8 GB) organized as 64G x 8 bits. It operates at clock frequencies up to 200 MHz and supports data bus widths of 1-bit, 4-bit, and 8-bit. The component functions within a voltage range of 2.7V to 3.6V and is rated for industrial temperatures from -40°C to 85°C. It is housed in a 153-pin FBGA package.

Memory IC Feature Summary

• Compliance with JEDEC eMMC 5.1 specification for standardized interface communication
• Integration of embedded flash controller with standard NAND flash memory
• Support for field firmware updates and power-off notification mechanisms

Memory IC Applications

• Small electronic devices requiring low power consumption
• Embedded systems utilizing high-speed eMMC protocols
• Portable consumer electronics needing reliable non-volatile storage

Memory IC Procurement Notes

Verify the exact suffix against official Flexxon documentation, as the provided model contains a potential typographical variance compared to verified listings like FEMC064GBE-T740. Confirm pinout compatibility and package dimensions prior to integration. Ensure supply chain sources provide valid RoHS compliance certificates and original manufacturer datasheets to guarantee authenticity and operational reliability.

Memory IC Selection Notes

Select this component for designs requiring robust eMMC 5.1 performance with flexible bus width options. Consider the industrial temperature range for harsh environments. Evaluate the 153-pin FBGA footprint for PCB layout constraints. Verify that the host system supports the required voltage levels and clock speeds for optimal throughput.

Memory IC Part Context

This part belongs to the XTRA VII series of eMMC flash memories from Flexxon. It represents a solution combining high performance with advanced power management. The series targets applications demanding good reliability and compact form factors. It serves as a foundational storage element for modern embedded hardware architectures.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Cross-referencing requires direct consultation with Flexxon technical support or authorized distributors to identify compatible alternatives with matching specifications.