FEMC064GBA-E540

Memory IC Overview

The FEMC064GBA-E540 is a 512Gbit (64GB) 3D TLC NAND flash memory component from the Flexxon AXO series, compliant with JEDEC eMMC 5.1 standards. It integrates an embedded flash controller within a 153-pin FBGA package measuring 11.5x13 mm. The device supports clock frequencies up to 200 MHz and offers data bus widths of 1-bit, 4-bit, or 8-bit. Operating voltage ranges from 2.7V to 3.6V, with an industrial temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 specification for standardized interface compatibility
• Integrates embedded flash controller with 3D TLC NAND for enhanced reliability
• Supports high-speed protocol with clock frequency up to 200 MHz
• Enables field firmware updates and power-off notification capabilities

Memory IC Applications

• Embedded storage in small, low-power electronic devices
• Industrial control systems requiring wide temperature operation
• Automotive infotainment and telematics units
• IoT gateways and edge computing modules

Memory IC Procurement Notes

Verify the specific suffix (E540) against official Flexxon documentation to confirm pinout and electrical characteristics. Ensure the supplier provides RoHS compliance certificates and original manufacturer packaging. Confirm lead times as they may vary based on production schedules. Request datasheet revisions to ensure alignment with current firmware support requirements.

Memory IC Selection Notes

Select this component when JEDEC eMMC 5.1 compatibility is required alongside industrial temperature ratings. The 153-pin FBGA package suits space-constrained designs. Consider the 200 MHz clock speed for bandwidth-intensive applications. Verify that the host controller supports the desired bus width configuration (1/4/8-bit) for optimal performance.

Memory IC Part Context

This part belongs to the Flexxon AXO series, designed for robust embedded storage solutions. It utilizes 3D TLC NAND technology to balance capacity and endurance. The eMMC 5.1 standard ensures broad interoperability with various host processors. The industrial grade rating distinguishes it from commercial variants for harsh environment deployment.

Memory IC Replacement Considerations

Direct substitutes must match the 153-pin FBGA footprint and eMMC 5.1 interface. Verify equivalent 512Gbit capacity and 2.7V-3.6V operating voltage. Check for identical temperature ranges (-40°C to 85°C). Cross-reference pin assignments to ensure mechanical and electrical compatibility without board redesign.