Memory IC FEMC064GBB-E530 product image

FEMC064GBB-E530

$33.85
  • Description:IC FLSH 512GBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:265e0277eaf3 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

FEMC064GBB-E530 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 512GBIT EMMC 5.1 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC064GBB-E530

  • Description:IC FLSH 512GBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC064GBB-E530

FEMC064GBB-E530

Memory IC Overview

The FEMC064GBB-E530 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It features a storage capacity of 64 Gbit organized as 64G x 8 bits, utilizing TLC technology. The device complies with the JEDEC eMMC 5.1 standard and operates at a clock frequency up to 200 MHz. It supports data bus widths of 1-bit, 4-bit, and 8-bit. The component functions within a voltage range of 2.7V to 3.6V and is rated for an operating temperature between -40°C and 85°C. It is housed in a surface-mount FBGA package.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 specification
  • Integrates embedded flash controller with NAND memory
  • Supports field firmware updates and power-off notifications

Memory IC Applications

  • Small electronic devices requiring low power consumption
  • Embedded systems needing high-speed protocol support
  • Portable consumer electronics

Memory IC Procurement Notes

Verify the exact suffix against official Flexxon documentation, as the provided model differs from the verified FEMC064GBE-T740 datasheet. Confirm pinout compatibility and specific electrical tolerances before integration. Ensure the supplier provides valid RoHS compliance certificates and original manufacturer traceability. Cross-reference the part number with current Flexxon product lists to confirm availability status.

Memory IC Selection Notes

Select this component for designs requiring eMMC 5.1 interface compatibility with flexible bus width options. Consider the wide operating temperature range for industrial or automotive environments. Evaluate the 200 MHz clock speed against system bandwidth requirements. Verify that the 100-FBGA or similar package fits the PCB layout constraints.

Memory IC Part Context

This part belongs to the Flexxon eMMC NAND flash memory family, designed for embedded applications. It combines a flash controller with TLC NAND dies in a single JEDEC-compliant package. The series targets markets demanding reliable non-volatile storage with advanced power management capabilities for compact form factors.

Memory IC FAQ

What data bus widths does the FEMC064GBB-E530 support?

It supports 1-bit (default), 4-bit, and 8-bit data bus widths.

Does the device support field firmware updates?

Yes, the component supports field firmware updates and includes power-off notification functionality.

FEMC064GBB-E530FEMC064GBB-E530
$33.85
Buy Now