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FEMC064GBB-E530 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 512GBIT EMMC 5.1 100FBGA. Review the specifications below when checking this part for your BOM.
The FEMC064GBB-E530 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It features a storage capacity of 64 Gbit organized as 64G x 8 bits, utilizing TLC technology. The device complies with the JEDEC eMMC 5.1 standard and operates at a clock frequency up to 200 MHz. It supports data bus widths of 1-bit, 4-bit, and 8-bit. The component functions within a voltage range of 2.7V to 3.6V and is rated for an operating temperature between -40°C and 85°C. It is housed in a surface-mount FBGA package.
Verify the exact suffix against official Flexxon documentation, as the provided model differs from the verified FEMC064GBE-T740 datasheet. Confirm pinout compatibility and specific electrical tolerances before integration. Ensure the supplier provides valid RoHS compliance certificates and original manufacturer traceability. Cross-reference the part number with current Flexxon product lists to confirm availability status.
Select this component for designs requiring eMMC 5.1 interface compatibility with flexible bus width options. Consider the wide operating temperature range for industrial or automotive environments. Evaluate the 200 MHz clock speed against system bandwidth requirements. Verify that the 100-FBGA or similar package fits the PCB layout constraints.
This part belongs to the Flexxon eMMC NAND flash memory family, designed for embedded applications. It combines a flash controller with TLC NAND dies in a single JEDEC-compliant package. The series targets markets demanding reliable non-volatile storage with advanced power management capabilities for compact form factors.
It supports 1-bit (default), 4-bit, and 8-bit data bus widths.
Yes, the component supports field firmware updates and includes power-off notification functionality.
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