FEMC064GBB-E540

Memory IC Overview

The FEMC064GBB-E540 is a 512Gbit NAND Flash memory component from Flexxon's AXO series, utilizing TLC technology and the eMMC 5.1 interface. It operates within a supply voltage range of 2.7V to 3.6V and supports a clock frequency of 200 MHz. The device is designed for industrial applications with an operating temperature range of -40°C to 105°C. It is housed in a 153-FBGA package measuring 11.5x13 mm and features surface mount mounting.

Memory IC Feature Summary

• Utilizes advanced 3D TLC NAND technology for high-density storage
• Complies with eMMC 5.1 standard for embedded multimedia card interfaces
• Engineered for extended industrial temperature operation ranges

Memory IC Applications

• Industrial computing systems requiring robust data retention
• Embedded multimedia devices utilizing eMMC standards
• High-capacity non-volatile storage solutions in harsh environments

Memory IC Procurement Notes

Verify the specific suffix E540 against official Flexxon documentation to confirm the exact temperature grade and package variant. Ensure compatibility with eMMC 5.1 host controllers. Check for RoHS compliance status as indicated in current datasheets. Confirm lead time availability directly with authorized distributors due to potential supply constraints.

Memory IC Selection Notes

Select this component when a 512Gbit capacity is required alongside strict industrial temperature specifications. The eMMC 5.1 interface ensures broad compatibility with existing embedded designs. Verify that the 153-FBGA footprint matches the PCB layout. Consider the TLC technology characteristics regarding endurance and write cycles for the specific application workload.

Memory IC Part Context

This part belongs to Flexxon's AXO series, which focuses on high-reliability NAND flash solutions. The FEMC064GBB-E540 specifically targets the embedded market, offering a balance of high density and industrial-grade durability. It represents a significant storage upgrade over lower-capacity variants within the same form factor.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult Flexxon technical support for direct equivalents or pin-compatible alternatives that meet the same electrical and thermal specifications.