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FEMC064GBE-E530 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 512GBIT EMMC 5.1 100FBGA. Review the specifications below when checking this part for your BOM.
The FEMC064GBE-E530 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It features a storage capacity of 64 Gbit organized as 64G x 8 bits and utilizes TLC technology. The device complies with the JEDEC eMMC 5.1 standard, operating at clock frequencies up to 200 MHz. It supports data bus widths of 1-bit, 4-bit, and 8-bit. The component operates within a voltage range of 2.7V to 3.6V and functions in temperatures from -40°C to 85°C. It is housed in a 153-pin FBGA package.
Verify the specific suffix E530 against official Flexxon documentation to confirm exact binning or revision status. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Validate that the 153-pin FBGA footprint matches the target PCB design constraints.
Select this component when an eMMC 5.1 interface is required for embedded applications. Consider the 64 Gbit capacity and 200 MHz clock speed for performance needs. Evaluate the -40°C to 85°C operating temperature range against environmental conditions. Verify support for 1-bit, 4-bit, and 8-bit data bus widths by the host system.
This part belongs to the XTRA VII series of eMMC flash memories from Flexxon. It combines an embedded flash controller with NAND memory in a single JEDEC standard package. The series emphasizes high performance, reliability, and advanced power management suitable for compact electronic designs.
It supports three data bus widths: 1-bit (default), 4-bit, and 8-bit.
Yes, the device supports field firmware updates and includes power-off notification capabilities.
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