Memory IC FEMC064GBE-E530 product image

FEMC064GBE-E530

$26.74
  • Description:IC FLSH 512GBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:be792eea631f Category: Brand:

  
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FEMC064GBE-E530 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 512GBIT EMMC 5.1 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC064GBE-E530

  • Description:IC FLSH 512GBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC064GBE-E530

FEMC064GBE-E530

Memory IC Overview

The FEMC064GBE-E530 is a NAND flash memory integrated circuit manufactured by Flexxon Pte Ltd. It features a storage capacity of 64 Gbit organized as 64G x 8 bits and utilizes TLC technology. The device complies with the JEDEC eMMC 5.1 standard, operating at clock frequencies up to 200 MHz. It supports data bus widths of 1-bit, 4-bit, and 8-bit. The component operates within a voltage range of 2.7V to 3.6V and functions in temperatures from -40°C to 85°C. It is housed in a 153-pin FBGA package.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 specification for standardized interface communication
  • Integrates embedded flash controller with standard NAND flash memory
  • Supports field firmware updates and power-off notification mechanisms

Memory IC Applications

  • Small electronic devices requiring low power consumption
  • Embedded systems utilizing high-speed eMMC protocols
  • Portable consumer electronics needing reliable non-volatile storage

Memory IC Procurement Notes

Verify the specific suffix E530 against official Flexxon documentation to confirm exact binning or revision status. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Validate that the 153-pin FBGA footprint matches the target PCB design constraints.

Memory IC Selection Notes

Select this component when an eMMC 5.1 interface is required for embedded applications. Consider the 64 Gbit capacity and 200 MHz clock speed for performance needs. Evaluate the -40°C to 85°C operating temperature range against environmental conditions. Verify support for 1-bit, 4-bit, and 8-bit data bus widths by the host system.

Memory IC Part Context

This part belongs to the XTRA VII series of eMMC flash memories from Flexxon. It combines an embedded flash controller with NAND memory in a single JEDEC standard package. The series emphasizes high performance, reliability, and advanced power management suitable for compact electronic designs.

Memory IC FAQ

What data bus widths does the FEMC064GBE-E530 support?

It supports three data bus widths: 1-bit (default), 4-bit, and 8-bit.

Does this component support field firmware updates?

Yes, the device supports field firmware updates and includes power-off notification capabilities.

FEMC064GBE-E530FEMC064GBE-E530
$26.74
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