Memory IC FEMC064GBE-T740 product image

FEMC064GBE-T740

$45.36
  • Description:IC FLSH 512GBIT EMMC 5.1 153FBGA
  • Series:XTRA VII
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:acb0cd80176e Category: Brand:

  
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FEMC064GBE-T740 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLSH 512GBIT EMMC 5.1 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC064GBE-T740

  • Description:IC FLSH 512GBIT EMMC 5.1 153FBGA
  • Series:XTRA VII
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC064GBE-T740

FEMC064GBE-T740

Memory IC Overview

The FEMC064GBE-T740 is a 64 GB (64G x 8-bit) 3D TLC NAND flash memory device from the XTRA VII series, manufactured by Flexxon Pte Ltd. It complies with the JEDEC eMMC 5.1 standard and integrates an embedded flash controller with standard NAND flash in a single package. The component operates within a voltage range of 2.7V to 3.6V and supports clock frequencies up to 200MHz. It features a 153-pin FBGA surface-mount package and supports data bus widths of 1-bit, 4-bits, and 8-bits.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 specification for high-speed protocol communication
  • Integrates embedded flash controller with 3D TLC NAND memory in a single package
  • Supports field firmware updates and power-off notification capabilities

Memory IC Applications

  • Small electronic devices requiring low power consumption
  • Embedded storage solutions for consumer electronics
  • Portable digital devices needing reliable non-volatile storage

Memory IC Procurement Notes

Verify the specific manufacturing origin and environmental compliance status directly with the supplier before procurement. Confirm that the RoHS and phthalate compliance certificates are current and applicable to the intended market regulations. Ensure the ordering suffix matches the required package and temperature specifications exactly as defined in the official datasheet to avoid functional mismatches.

Memory IC Selection Notes

Select this component when a compact, high-reliability storage solution is required for low-power applications. The integrated controller simplifies system design by handling wear leveling and error correction internally. Ensure the host system supports the eMMC 5.1 interface and can accommodate the 153-pin FBGA footprint. Verify that the operating temperature range meets the environmental requirements of the final product deployment.

Memory IC Part Context

This part belongs to the XTRA VII series of eMMC flash memories designed for robust performance in demanding environments. Flexxon specializes in industrial-grade storage solutions, emphasizing reliability and advanced power management. The series targets applications where data integrity and longevity are critical, leveraging 3D NAND technology to provide higher density in a small form factor compared to older planar NAND generations.

Memory IC FAQ

Does the FEMC064GBE-T740 support parallel data transfer modes?

Yes, it supports three data bus widths: 1-bit (default), 4-bits, and 8-bits, allowing for flexible parallel data transfer configurations.

What is the maximum clock frequency supported by this eMMC device?

The device supports a clock frequency range from 0 to 200MHz, enabling high-speed data access rates compliant with the eMMC 5.1 standard.

FEMC064GBE-T740FEMC064GBE-T740
$45.36
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