Memory IC FEMC064GBE-TC40 product image

FEMC064GBE-TC40

$71.64
  • Description:IC FLASH 512GBIT EMMC 153FBGA
  • Series:XTRA V
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:5f78cedafe9b Category: Brand:

  
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FEMC064GBE-TC40 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 512GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC064GBE-TC40

  • Description:IC FLASH 512GBIT EMMC 153FBGA
  • Series:XTRA V
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC064GBE-TC40

FEMC064GBE-TC40

Memory IC Overview

The FEMC064GBE-TC40 is a 512Gbit (64GB) NAND flash memory IC from Flexxon’s XTRA VII series, compliant with JEDEC eMMC 5.1 standards. It integrates an embedded flash controller and TLC NAND in a 153-pin FBGA package. The device supports clock frequencies up to 200MHz and data bus widths of 1-bit, 4-bit, or 8-bit. Operating voltage ranges from 2.7V to 3.6V, with a temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 standard for high-speed protocol communication
  • Integrates embedded flash controller with standard NAND flash memory
  • Supports field firmware updates and power-off notification features

Memory IC Applications

  • Small electronic devices requiring low power consumption
  • Embedded systems needing reliable non-volatile storage
  • Industrial applications operating within extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix TC40 against T740 to confirm exact thermal and operational specifications. Confirm RoHS compliance status directly with the manufacturer. Ensure the 153-pin FBGA footprint matches the target PCB design. Validate that the 200MHz clock frequency meets system timing requirements.

Memory IC Selection Notes

Select this component when JEDEC eMMC 5.1 compatibility is required for host controllers. Choose the 153-pin FBGA package for compact surface-mount designs. Consider the -40°C to 85°C range for industrial environments. Verify interface width support if 8-bit operation is necessary for maximum throughput.

Memory IC Part Context

This part belongs to Flexxon’s XTRA VII series of eMMC solutions. It utilizes 3D TLC NAND technology for high-density storage. The series emphasizes reliability and advanced power management for embedded applications.

Memory IC Replacement Considerations

FEMC064GBE-T740 is a related variant within the same series. Verify pinout and electrical specifications before substitution.

FEMC064GBE-TC40FEMC064GBE-TC40
$71.64
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