ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
FEMC064GTTE7-T14-46 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 512GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMC064GTTE7-T14-46
- Description：IC FLASH 512GBIT EMMC 153FBGA
- Series：XTRA III
- Mfr：Flexxon Pte Ltd
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMC064GTTE7-T14-46
Memory IC Overview
The FEMC064GTTE7-T14-46 is a non-volatile NAND flash memory IC manufactured by Flexxon Pte Ltd. It features a storage capacity of 512Gb organized as 64G x 8 bits and utilizes the eMMC interface standard. The device operates with a clock frequency of 200 MHz and supports a supply voltage range of 2.7V to 3.6V. It is housed in a 153-FBGA package measuring 11.5x13 mm, designed for surface mount installation. The component functions within an operating temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Integrates embedded flash controller with MLC NAND technology
- Complies with JEDEC eMMC standards for standardized connectivity
- Supports field firmware updates and power-off notification capabilities
Memory IC Applications
- Small electronic devices requiring low power consumption
- Embedded systems needing high-speed data transfer protocols
- Portable consumer electronics utilizing robust storage solutions
Memory IC Procurement Notes
Verify the specific suffix T14-46 against official Flexxon documentation to confirm exact manufacturing lot or revision details. Confirm RoHS3 compliance status and moisture sensitivity level (MSL 3) requirements prior to assembly planning. Ensure voltage supply parameters align with system design specifications before procurement.
Memory IC Selection Notes
Select this component when a 512Gb capacity is required in a compact 153-FBGA form factor. Consider the -40°C to 85°C industrial temperature range for environmental suitability. Evaluate the 200 MHz clock speed against system bandwidth requirements. Verify compatibility with existing eMMC host controllers supporting the specified protocol version.
Memory IC Part Context
This part belongs to the XTRA III series of eMMC flash memories from Flexxon. It represents a solution combining high-density storage with embedded control for simplified system integration. The product line targets applications demanding reliability and advanced power management within standard JEDEC packages.
Memory IC Replacement Considerations
Consult official Flexxon substitution guides for verified alternatives. Cross-reference pinout and electrical characteristics carefully. Generic eMMC replacements may not match specific firmware or performance traits.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
