Memory IC FEMC128G-M10 product image

FEMC128G-M10

$25.13
  • Description:IC FLASH 1TBIT EMMC 5.1 153FBGA
  • Series:ECON II
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:95588c405df0 Category: Brand:

  
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FEMC128G-M10 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 1TBIT EMMC 5.1 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC128G-M10

  • Description:IC FLASH 1TBIT EMMC 5.1 153FBGA
  • Series:ECON II
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:1Tbit
  • Memory Organization:128G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC128G-M10

FEMC128G-M10

Memory IC Overview

The Flexxon FEMC128G-M10 is a non-volatile NAND flash memory IC utilizing TLC technology, organized as 128G x 8 bits for a total capacity of 1Tb. It implements the eMMC 5.1 interface with a clock frequency of 200 MHz. The device operates within a voltage range of 2.7V to 3.6V and supports an industrial temperature range from -25°C to 85°C. It is housed in a 153-FBGA package measuring 11.5x13 mm.

Memory IC Feature Summary

  • Supports eMMC 5.1 standard for embedded multimedia card applications
  • Utilizes Triple-Level Cell (TLC) NAND flash technology
  • Designed for surface mount installation in compact form factors

Memory IC Applications

  • Embedded systems requiring high-density storage
  • Industrial control units operating in extended temperature ranges
  • Mobile devices and portable electronics

Memory IC Procurement Notes

Verify component authenticity through authorized Flexxon distributors or official channels. Confirm that the specific revision matches project requirements. Ensure proper handling procedures are followed due to moisture sensitivity level 3 classification. Validate electrical parameters against the official datasheet before integration into final designs.

Memory IC Selection Notes

Select this component when eMMC 5.1 compatibility is required alongside 1Tb capacity. Consider the 153-FBGA footprint for PCB layout constraints. Evaluate thermal management needs given the -25°C to 85°C operational range. Compare power consumption specifications against system battery life requirements.

Memory IC Part Context

This part belongs to the ECON II series of embedded flash memory solutions. It represents a high-capacity storage option within Flexxon's portfolio of industrial-grade memory products. The designation indicates its specific interface version and physical package configuration relative to other variants in the family.

Memory IC Replacement Considerations

Check for direct substitutes within the same ECON II series offering identical pinouts and electrical characteristics. Verify compatibility with existing controller interfaces if swapping manufacturers. Ensure any alternative maintains the same eMMC 5.1 compliance and temperature ratings.

FEMC128G-M10FEMC128G-M10
$25.13
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