Memory IC FEMC128GBA-E530 product image

FEMC128GBA-E530

$68.68
  • Description:IC FLASH 1TBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:08ca14999e20 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

FEMC128GBA-E530 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 1TBIT EMMC 5.1 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC128GBA-E530

  • Description:IC FLASH 1TBIT EMMC 5.1 100FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:1Tbit
  • Memory Organization:128G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC128GBA-E530

FEMC128GBA-E530

Memory IC Overview

The FEMC128GBA-E530 is an AXO series industrial embedded multimedia card (eMMC) manufactured by Flexxon Pte Ltd. It complies with the JEDEC eMMC 5.1 standard and utilizes 3D TLC NAND flash technology. The device provides a storage capacity of 128 gigabytes, equivalent to 1 terabit, within a compact 153-ball Fine-Pitch Ball Grid Array (153-FBGA) surface-mount package. Designed for high reliability in demanding environments, it integrates controller logic directly onto the chip to manage wear leveling and error correction.

Memory IC Feature Summary

  • Compliance with JEDEC eMMC 5.1 interface standards for broad compatibility
  • Integration of 3D TLC NAND flash memory for dense data storage
  • Industrial-grade ruggedization engineered for harsh operational conditions

Memory IC Applications

  • Military systems requiring extreme environmental resilience
  • High-power motor control cabinets
  • Industrial edge management devices

Memory IC Procurement Notes

Verify the specific suffix code against official Flexxon documentation to confirm exact performance grades and temperature ranges. Ensure the ordering part number matches the required package type and capacity specifications precisely before procurement.

Memory IC Selection Notes

Select this component when a robust, non-volatile storage solution is required for industrial applications. The eMMC 5.1 interface ensures standardized connectivity, while the industrial design supports stability in environments with shock, vibration, or power instability.

Memory IC Part Context

This model belongs to the Flexxon AXO series, which focuses on providing reliable storage for critical infrastructure. The series is characterized by its ability to maintain data integrity under stress, making it suitable for sectors where system failure is not an option.

Memory IC Replacement Considerations

Check for compatible eMMC 5.1 alternatives from other manufacturers that offer similar form factors and capacities. Verify pinout compatibility and electrical characteristics before substituting.

FEMC128GBA-E530FEMC128GBA-E530
$68.68
Buy Now