FEMC128GBE-T740

Memory IC Overview

The FEMC128GBE-T740 is a 128 GB embedded MultiMediaCard (eMMC) flash memory from Flexxon's XTRA VII series. It utilizes 3D TLC NAND technology and complies with the JEDEC eMMC 5.1 standard. The device integrates an embedded flash controller within a 153-pin FBGA package. It supports clock frequencies up to 200 MHz and offers data bus widths of 1-bit, 4-bit, or 8-bit. Operating voltage ranges from 2.7V to 3.6V, with an industrial temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 specification for standardized interface compatibility
• Integrates embedded flash controller with 3D TLC NAND memory in a single package
• Supports field firmware updates and power-off notification mechanisms

Memory IC Applications

• Small electronic devices requiring low power consumption
• Industrial applications operating within extended temperature ranges
• Embedded systems utilizing high-speed eMMC protocols

Memory IC Procurement Notes

Verify component authenticity through authorized Flexxon distributors. Confirm package integrity upon receipt, as the 153-pin FBGA requires careful handling. Ensure environmental compliance certificates match project requirements. Validate that the specific revision matches design specifications before integration into production lines.

Memory IC Selection Notes

Select this component when JEDEC eMMC 5.1 compliance is mandatory. Choose this part for designs requiring 128 GB capacity with 3D TLC density. Consider this option for applications needing support for 8-bit bus width operations at 200 MHz. Verify thermal management capabilities align with the -40°C to 85°C operating range.

Memory IC Part Context

This model belongs to the XTRA VII series of embedded flash memories. It represents a solution combining controller and NAND in a JEDEC standard package. The series targets reliability and advanced power management for embedded storage needs.

Memory IC Replacement Considerations

Direct substitutes include other eMMC 5.1 devices with identical pinouts and capacities. Verify electrical parameters such as voltage and speed grades match exactly. Check if alternative vendors offer equivalent 3D TLC NAND configurations.