FEMC256GBE-E530

Memory IC Overview

The FEMC256GBE-E530 is a non-volatile NAND flash memory IC manufactured by Flexxon Pte Ltd. It utilizes TLC technology and offers a storage capacity of 2Tb, organized as 256G x 8 bits. The device complies with the eMMC 5.1 standard and operates at a clock frequency of 200 MHz. It functions within a voltage range of 2.7V to 3.6V and supports an operating temperature from -40°C to 85°C. The component is housed in a 100-FBGA package measuring 14x18 mm.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 specification for standardized interface communication
• Integrates embedded flash controller with NAND memory in a single package
• Supports field firmware updates and power-off notification capabilities

Memory IC Applications

• Small electronic devices requiring low power consumption
• Portable consumer electronics utilizing high-speed data transfer
• Embedded systems demanding reliable non-volatile storage

Memory IC Procurement Notes

Verify the specific ordering suffix against official Flexxon documentation to confirm exact package dimensions and electrical characteristics. Ensure compatibility with host system voltage requirements ranging from 2.7V to 3.6V. Confirm that the design accommodates the 100-FBGA footprint and thermal specifications for the industrial temperature range. Check current supply status as availability may fluctuate due to temporary restrictions.

Memory IC Selection Notes

Select this component when a high-capacity 2Tb storage solution is required within a compact 100-pin form factor. The eMMC 5.1 interface ensures broad compatibility with modern embedded hosts. Consider the 200 MHz clock speed for applications needing efficient data throughput. Verify that the TLC technology aligns with the endurance requirements of the target application environment.

Memory IC Part Context

This part belongs to the AXO series of eMMC flash memories produced by Flexxon. It represents a high-density storage option designed for integration into space-constrained electronic designs. The device combines advanced NAND technology with a robust controller to deliver performance suitable for demanding embedded environments.

Memory IC Replacement Considerations

Consult official Flexxon substitution guides for verified alternatives. Cross-reference pinouts and electrical parameters before considering any third-party equivalents.