ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
FEMDNN032G-C9A55 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is 32GB EMMC TLC 5.1 -25C+85C IND. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMDNN032G-C9A55
- Description：32GB EMMC TLC 5.1 -25C+85C IND
- Series：-
- Mfr：Lexar Enterprise
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：32GByte (NAND)
- Memory Organization：-
- Memory Interface：eMMC_5.1
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：5ns
- Voltage - Supply：1.8V ~ 3.3V
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-BGA
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMDNN032G-C9A55
Memory IC Overview
The Lexar Enterprise FEMDNN032G-C9A55 is a 32GB NAND flash memory IC utilizing TLC technology and eMMC 5.1 interface. It operates at a clock frequency of 200 MHz with a write cycle time of 5ns. The device supports a supply voltage range of 1.8V to 3.3V and functions within an industrial temperature range of -25°C to +85°C. It is housed in a 153-BGA surface-mount package and holds RoHS3 compliance.
Memory IC Feature Summary
- Industrial-grade reliability designed for extended operation in harsh environments
- Supports eMMC 5.1 standard for simplified CPU platform development
- Wide operating temperature range suitable for demanding applications
Memory IC Applications
- Automotive embedded systems requiring wide-temperature stability
- Industrial control equipment needing high reliability
- Consumer electronics operating in variable environmental conditions
Memory IC Procurement Notes
Verify component authenticity through authorized channels as this part is marked as obsolete. Confirm final assembly compatibility with the 153-BGA footprint and electrical specifications. Check for available replacement alternatives from the manufacturer due to end-of-life status. Ensure supply chain sources provide valid traceability documentation.
Memory IC Selection Notes
Select this component when an industrial temperature range of -25°C to +85°C is required for eMMC storage. The 32GB capacity and TLC technology offer a balance of density and cost. Ensure the design supports the 1.8V to 3.3V voltage domain and 153-BGA package constraints.
Memory IC Part Context
This component belongs to the Lexar Enterprise FORESEE series, focusing on reliable storage solutions. Lexar Enterprise provides memory products engineered for specific industrial and automotive applications, emphasizing durability and performance consistency under stress.
Memory IC Replacement Considerations
Check for updated part numbers from Lexar Enterprise or compatible eMMC 5.1 devices with matching 153-BGA packages and industrial temperature ratings.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
