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FEMDNN064G-A3A55 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is 64GB EMMC TLC 5.1 -25C+85C IND. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMDNN064G-A3A55
- Description：64GB EMMC TLC 5.1 -25C+85C IND
- Series：-
- Mfr：Lexar Enterprise
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：64GByte (NAND)
- Memory Organization：-
- Memory Interface：eMMC_5.1
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：5ns
- Voltage - Supply：1.8V ~ 3.3V
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-BGA
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMDNN064G-A3A55
Memory IC Overview
The Lexar Enterprise FEMDNN064G-A3A55 is a non-volatile NAND flash memory integrated circuit utilizing TLC technology. It features a 64GB storage capacity and adheres to the eMMC 5.1 interface standard. The device operates with a clock frequency of 200 MHz and supports a supply voltage range of 1.8V to 3.3V. Designed for industrial environments, it maintains functionality within an operating temperature range of -25°C to 85°C. The component is housed in a 153-BGA surface-mount package.
Memory IC Feature Summary
- Supports eMMC 5.1 protocol for standardized embedded multimedia card communication
- Utilizes Triple-Level Cell (TLC) NAND architecture for high-density data storage
- Engineered for industrial-grade reliability across extended temperature ranges
Memory IC Applications
- Industrial control systems requiring robust embedded storage
- Automotive infotainment and telematics modules
- IoT gateways and edge computing devices
Memory IC Procurement Notes
Verify current availability status as this component may be discontinued or subject to limited stock. Confirm exact ordering suffixes match the required voltage and temperature specifications. Request latest datasheets to ensure compatibility with target system interfaces. Validate RoHS compliance documentation prior to integration into regulated products.
Memory IC Selection Notes
Select this component when a 64GB capacity is required within strict industrial temperature constraints. Ensure the host controller supports eMMC 5.1 signaling levels and the 153-BGA footprint. Compare against alternative capacities if higher density is needed, while verifying power supply stability within the 1.8V-3.3V range.
Memory IC Part Context
This part belongs to the Lexar Enterprise FEMDNN series of embedded flash solutions. These components are designed for OEM applications demanding reliable data retention in compact form factors. The series typically includes various capacity options sharing similar interface protocols and physical dimensions.
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