Memory IC FEMDRM008G-58A39 product image

FEMDRM008G-58A39

$5.46
  • Description:8GB EMMC MLC 5.1 -25C+85C IND
  • Series:-
  • Mfr:Lexar Enterprise
  • Package:Tray

SKU:57b13da046b8 Category: Brand:

  
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FEMDRM008G-58A39 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is 8GB EMMC MLC 5.1 -25C+85C IND. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMDRM008G-58A39

  • Description:8GB EMMC MLC 5.1 -25C+85C IND
  • Series:-
  • Mfr:Lexar Enterprise
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:8GByte (NAND)
  • Memory Organization:-
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:5ns
  • Voltage - Supply:1.8V ~ 3.3V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-BGA
  • Supplier Device Package:-
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMDRM008G-58A39

FEMDRM008G-58A39

Memory IC Overview

The FEMDRM008G-58A39 is an industrial-grade eMMC 5.1 embedded storage solution manufactured by Longsys under the FORESEE brand. It integrates NAND flash and a controller within a 153-ball FBGA package measuring 11.5 x 13.0 x 1.0 mm. The device offers 8GB capacity with read speeds up to 230 MB/s and write speeds up to 105 MB/s. It supports data bus widths of 1, 4, or 8 bits and clock frequencies up to 200 MHz. Operating voltages are 2.7–3.6V for VCC and 1.7–1.95V or 2.7–3.6V for VCCQ. The component operates within a temperature range of -25°C to +85°C.

Memory IC Feature Summary

  • Compliance with JEDEC eMMC 5.1 specifications, including backward compatibility with versions 4.41 through 5.0.
  • Integrated hardware ECC engine and global wear-leveling algorithms to ensure data integrity and device endurance.
  • Sudden-power-loss safeguard mechanism designed to prevent data corruption during unexpected power failures.
  • Support for HS400 and HS200 high-speed modes, boot partitions, RPMB, and Field Firmware Update (FFU).

Memory IC Applications

  • Industrial control systems requiring reliable embedded storage
  • Automotive infotainment and telematics units
  • Network infrastructure equipment
  • Medical imaging devices

Memory IC Procurement Notes

Verify the specific part number against official manufacturer documentation to confirm current availability status. Check for any recent revisions or obsolescence notices from Longsys Electronics. Ensure that the required voltage levels and interface timings match your system design constraints before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when an industrial temperature range and robust data protection features are required. Consider the 153-ball FBGA package size for PCB layout compatibility. Evaluate the need for HS400/HS200 high-speed interfaces and specific partition configurations such as RPMB or boot areas based on application requirements.

Memory IC Part Context

This component belongs to the FORESEE industrial eMMC series produced by Longsys Electronics. It is designed for demanding environments where standard consumer-grade storage may not suffice. The product line emphasizes reliability, longevity, and compliance with strict industrial standards for embedded memory solutions.

Memory IC Replacement Considerations

Consult official datasheets for compatible alternatives. Verify pinout compatibility and electrical specifications before substituting.

FEMDRM008G-58A39FEMDRM008G-58A39
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