FEMDRM032G-A3A55

$7.61

Description：32GB EMMC TLC 5.1 -25C+85C IND
Series：-
Mfr：Lexar Enterprise
Package：Tray

SKU:ba2386672f5e Category: Memory IC Brand: Lexar Enterprise

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Product introduction

FEMDRM032G-A3A55 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is 32GB EMMC TLC 5.1 -25C+85C IND. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMDRM032G-A3A55

Description：32GB EMMC TLC 5.1 -25C+85C IND
Series：-
Mfr：Lexar Enterprise
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (TLC)
Memory Size：32GByte (NAND)
Memory Organization：-
Memory Interface：eMMC_5.1
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：5ns
Voltage - Supply：1.8V ~ 3.3V
Operating Temperature：-25°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：153-BGA
Supplier Device Package：-
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FEMDRM032G-A3A55

FEMDRM032G-A3A55

Memory IC Overview

The Lexar Enterprise FEMDRM032G-A3A55 is a 32GB Industrial eMMC embedded storage component manufactured by Longsys under the FORESEE brand. It operates on the eMMC 5.1 interface within an FBGA153 package measuring 11.5 x 13 x 1.0 mm. The device supports dual voltage inputs of 1.8V and 3.3V, utilizes 3D NAND memory technology, and functions reliably across a temperature range of -25°C to 85°C.

Memory IC Feature Summary

Supports FFU (Firmware Update) for active data organization and system smoothness.
Includes power-loss protection mechanisms to ensure data validity during voltage instability.
Utilizes pSLC mode enhancement for free blocks to boost read/write performance.
Features pre-exchange data replacement to maintain key data security and reliability.

Memory IC Applications

Industrial automation systems
Communication base stations
Smart TVs and set-top boxes

Memory IC Procurement Notes

Verify that the specific part number matches the required industrial temperature range and voltage specifications. Confirm compatibility with the target SoC platform's eMMC 5.1 controller support. Ensure the procurement channel provides official documentation regarding the 3D NAND configuration and package dimensions.

Memory IC Selection Notes

Select this component for applications requiring robust industrial-grade stability and extended operational temperatures. The 32GB capacity suits moderate data storage needs in embedded environments. Consider the FBGA153 footprint for PCB layout constraints and verify that the host system supports the necessary firmware update features for long-term maintenance.

Memory IC Part Context

This component belongs to the FORESEE Industrial eMMC product line, established by Longsys Electronics. The series targets demanding environments such as automotive electronics and industrial control, emphasizing high reliability and compliance with industry standards like IATF 16949 for quality management.