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FEMKNN004G-58A42 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is FORESEE EMMC. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FEMKNN004G-58A42
- Description：FORESEE EMMC
- Series：-
- Mfr：Lexar Enterprise
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：32Gbit
- Memory Organization：4G x 8
- Memory Interface：eMMC_5.1
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-WFBGA
- Supplier Device Package：153-BGA (7.5x9)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FEMKNN004G-58A42
Memory IC Overview
The Lexar Enterprise FEMKNN004G-58A42 is a 32Gbit (4GB) NAND Flash memory IC utilizing Multi-Level Cell (MLC) technology. It implements the eMMC 5.1 interface standard within a 153-BGA package measuring 7.5x9 mm. The device supports sequential read speeds of 60MB/s and sequential write speeds of 55MB/s. Operating voltage for the NAND core ranges from 2.7V to 3.6V. The component is rated for an extended industrial temperature range of -25°C to +85°C.
Memory IC Feature Summary
- Industrial-grade reliability with extended temperature tolerance
- Embedded MultiMediaCard 5.1 interface compatibility
- Multi-Level Cell NAND architecture for balanced performance
Memory IC Applications
- Industrial control systems
- Consumer electronics storage
- Embedded subsize applications
Memory IC Procurement Notes
Verify the manufacturer designation carefully, as this part number appears in listings associated with both Lexar Enterprise and FORESEE. Confirm the specific datasheet version and quality grade required for your application before ordering. Ensure the 153-BGA footprint matches your PCB design constraints.
Memory IC Selection Notes
Select this component when an eMMC 5.1 interface is required for embedded storage solutions operating in harsh environments. The MLC NAND technology offers a balance between endurance and cost. Verify that the 4GB capacity meets system requirements and that the BGA153 package fits the available board space.
Memory IC Part Context
This component belongs to the embedded flash memory category, specifically designed for integration into compact electronic devices. It serves as non-volatile storage for firmware, operating systems, and user data in mobile and industrial platforms requiring robust data retention.
Memory IC Replacement Considerations
The FEMDNN004G-58A42 is listed as a related variant with similar specifications. Verify pinout compatibility and exact speed grades before substitution.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
