FI168B259762-T

Overview

The FI168B259762-T is a high-frequency bandpass filter manufactured by Taiyo Yuden, designed for RF signal conditioning applications. It operates within a frequency range of 2.3 GHz to 2.7 GHz, with a center frequency of 2.593 GHz and a bandwidth of 195 MHz. The component features a 50 Ohm impedance and an insertion loss of 2.2 dB. Packaged in a compact 0603 (1608 metric) surface-mount device (SMD/SMT) format, it supports board mounting and functions reliably within an operating temperature range of -30°C to +85°C.

Feature Summary

• Provides selective frequency filtering within the specified high-frequency bandpass range
• Utilizes multilayer construction for stable RF signal conditioning
• Designed for direct surface-mount integration onto printed circuit boards

Applications

• RF front-end modules requiring bandpass filtering
• Wireless communication systems operating near 2.6 GHz
• Signal conditioning circuits in mobile devices

Procurement Notes

Verify component authenticity through authorized distribution channels due to its discontinued status. Confirm RoHS compliance details via the official datasheet before integration. Ensure storage conditions maintain component integrity given the end-of-life designation. Cross-reference pinout and footprint specifications against current PCB layouts to prevent assembly errors during replacement or legacy system maintenance.

Selection Notes

Select this component when a 0603 footprint bandpass filter is required for frequencies around 2.593 GHz. Consider the 2.2 dB insertion loss and 195 MHz bandwidth constraints relative to system requirements. Evaluate thermal performance within the -30°C to +85°C operational range. Verify compatibility with existing SMD reflow processes and impedance matching networks in the target RF circuit design.

Part Context

This part belongs to the FI series of RF filters from Taiyo Yuden, specialized for high-frequency applications. It represents a multilayer ceramic technology solution for compact RF designs. The component addresses the need for precise frequency selection in space-constrained electronic assemblies, serving as a critical element for maintaining signal integrity in modern wireless infrastructure and portable electronics.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.