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Product Detailed Parameters
- Description：RF FILT BAND PASS 5.5375GHZ 0603
- Series：FI
- Mfr：Taiyo Yuden
- Package：Tape & Reel (TR),Cut Tape (CT)
- Frequency：5.5375GHz Center
- Bandwidth：775MHz
- Filter Type：Band Pass
- Ripple：-
- Insertion Loss：1.2dB
- Mounting Type：Surface Mount
- Package / Case：0603 (1608 Metric), 3 PC Pad
- Size / Dimension：0.063" L x 0.031" W (1.60mm x 0.80mm)
- Height (Max)：0.026" (0.65mm)
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Overview
The Taiyo Yuden FI168B5538FW-T is a multilayer ceramic bandpass filter designed for high-frequency signal conditioning. It operates within the 5.15 GHz to 5.925 GHz frequency range, covering LTE Licensed Assisted Access and Wireless LAN bands. The component features a 0603 (1608 metric) surface-mount package with dimensions of 1.6 x 0.8 x 0.65 mm. It maintains a nominal impedance of 50 Ohms and exhibits an insertion loss of 1.2 dB. The device supports an operating temperature range from -40°C to +85°C.
Feature Summary
- Multilayer ceramic construction for stable RF filtering performance
- Compact 0603 surface-mount footprint for space-constrained designs
- Optimized passband coverage for LTE-LAA and Wi-Fi applications
Applications
- LTE Licensed Assisted Access (LAA) systems
- Wireless Local Area Network (WLAN) devices
- 5 GHz ISM band communication modules
Procurement Notes
Verify current lifecycle status as the part may be subject to discontinuance notifications. Confirm RoHS3 compliance and specific packaging quantities such as tape-and-reel counts before ordering. Ensure design-in compatibility with target PCB layout constraints given the small 0603 package size.
Selection Notes
Select this component when a compact bandpass filter is required for the 5.15–5.925 GHz range. Consider the 1.2 dB insertion loss and 50 Ohm impedance match against system link budget requirements. Evaluate thermal stability across the -40°C to +85°C range for environmental suitability.
Part Context
This component belongs to Taiyo Yuden's FI series of multilayer ceramic filters. These devices are engineered for RF signal conditioning in wireless infrastructure and mobile terminals. The FI series emphasizes miniaturization while maintaining consistent electrical characteristics across varying temperature conditions.
Replacement Considerations
Public documentation identifies TSB1N18D5G53LV0FWT as a related or replacement part number. Verify functional equivalence and pinout compatibility before substitution.
