FI168P0829FK-T

Overview

The FI168P0829FK-T is a ceramic diplexer manufactured by Taiyo Yuden, designed for radio frequency signal separation. It operates within the 824MHz to 960MHz low band and 1.558GHz to 1.61GHz high band. The component utilizes a surface-mount technology package with dimensions of 1608 metric (0603). It features flexible terminals suitable for board mounting and complies with RoHS3 standards. The device is classified as a dual-band filter intended for RF applications requiring specific frequency isolation.

Feature Summary

• Dual-band frequency separation capability for distinct RF bands
• Compact 0603 surface-mount footprint for space-constrained designs
• Flexible terminal construction for reliable board attachment

Applications

• RF front-end modules in mobile communication devices
• Wireless transceiver systems requiring band separation
• Mobile phone antenna switching circuits

Procurement Notes

Verify current availability status as the component may be subject to supply constraints. Confirm that the specific suffix matches the required frequency specifications for your design. Ensure compatibility with existing PCB layout and soldering profiles. Check for any recent product change notifications regarding manufacturing updates or end-of-life declarations before finalizing procurement plans.

Selection Notes

Select this component when a compact solution is needed for separating low and high frequency bands in RF paths. Consider the 0603 package size for density requirements. Verify insertion loss and rejection characteristics against system specifications. Ensure the operating temperature range meets environmental conditions. Compare performance metrics with alternative diplexers if stricter size or electrical constraints exist.

Part Context

This part belongs to the FI series of RF filters from Taiyo Yuden, which focuses on miniaturized components for wireless communications. The series includes various diplexers and filters tailored for mobile infrastructure and handheld devices. These components are engineered to provide high performance in small form factors, supporting the trend toward smaller electronic devices.

Replacement Considerations

No public substitute part numbers are confirmed for this specific model.