FI212C245032-T

Overview

The FI212C245032-T is a surface-mount RF balun manufactured by Taiyo Yuden, designed for signal conditioning in wireless applications. It operates within a frequency range of 2.4GHz to 2.5GHz with a center frequency of 2.45GHz. The component provides a balanced-to-unbalanced impedance transformation between 50 Ohms and - Ohms. Key electrical specifications include an insertion loss of 3.7dB and a bandwidth of 100MHz. It is housed in a compact 0805 (2012 metric) package with six printed circuit board pads. The device supports SMD/SMT installation types and functions reliably within an operating temperature range of -30°C to +85°C.

Feature Summary

• Provides balanced-to-unbalanced signal conversion for high-frequency RF circuits
• Compact 0805 surface-mount footprint suitable for space-constrained designs
• Operates effectively within the 2.4GHz to 2.5GHz ISM band

Applications

• Wireless LAN modules requiring 2.4GHz signal integrity
• Bluetooth low energy transceivers
• Zigbee and other 2.4GHz IoT communication devices

Procurement Notes

Verify component authenticity through official manufacturer channels or authorized distributors. Confirm RoHS compliance status and check for End-of-Life notifications, as this part may be obsolete or not recommended for new designs. Ensure packaging format matches production requirements. Validate datasheet revisions to confirm current electrical parameters before integration into final assemblies.

Selection Notes

Select this component when a compact balun solution is required for 2.4GHz applications. Consider the 0805 package size for PCB layout constraints. Evaluate the 3.7dB insertion loss against system link budget requirements. Verify thermal performance within the specified -30°C to +85°C range for the intended operating environment.

Part Context

This component belongs to the FI series of RF filters and baluns from Taiyo Yuden. These components are engineered for high-frequency signal processing in consumer electronics and industrial wireless systems. The FI series emphasizes miniaturization and reliable performance in compact form factors, supporting modern mobile and IoT device architectures.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult manufacturer engineering support for direct replacements or pin-compatible alternatives if this obsolete part is required for maintenance.