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FI212C245033-T is listed in the Balun range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is BALUN 2.4GHZ-2.5GHZ 0805. Review the specifications below when checking this part for your BOM.
The FI212C245033-T is a multilayer ceramic balance-type device manufactured by Taiyo Yuden. It functions as an RF balun converter designed for signal conditioning within the 2.4GHz to 2.5GHz frequency range. The component provides a 50-ohm impedance transformation and features a maximum insertion loss of 3.0dB with a phase difference of 180° ±10°. Packaged in a 0805 (2012 metric) surface-mount format with six PCB pads, it supports tape-and-reel delivery. The part is RoHS3 compliant and classified as Not Recommended for New Designs.
Verify component authenticity through authorized distribution channels due to the Not Recommended for New Design status. Confirm that the 0805 package dimensions align with existing PCB footprints. Ensure compliance with RoHS3 standards if required by target market regulations. Validate that the 3.0dB insertion loss meets system performance requirements before finalizing procurement plans.
Select this component for designs operating strictly within the 2.4GHz to 2.5GHz spectrum. The 50-ohm impedance rating suits standard RF transmission lines. Consider the 180-degree phase shift capability for differential signal processing. Evaluate the physical size constraints against the 0805 footprint availability. Assess the impact of the 3.0dB insertion loss on overall link budget efficiency.
This balun belongs to the FI series of multilayer ceramic devices from Taiyo Yuden. These components are engineered for high-frequency signal integrity in space-constrained environments. The specific model targets the ISM band commonly used for short-range wireless communications. Its ceramic construction offers stability compared to alternative technologies.
No direct substitute part numbers are confirmed in public documentation. The component is marked Not Recommended for New Designs, indicating potential obsolescence risks. Engineers should evaluate current stock levels carefully. Alternative solutions may require redesigning the RF front-end circuitry to accommodate different impedance or form factor specifications.
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