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FI212P245003-T is listed in the RF Multiplexers range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is RF DIPLEXER 5.025/5.6475GHZ MOD. Review the specifications below when checking this part for your BOM.
The FI212P245003-T is a high-frequency signal conditioning component manufactured by Taiyo Yuden, classified as a balun within the RF and wireless category. It operates within a frequency range of 2.4GHz to 2.5GHz, supporting applications in Bluetooth systems. The device features an impedance configuration of 50 Ohms for unbalanced ports and unspecified balanced port impedance. It exhibits a maximum insertion loss of 3.0dB at 25°C and 3.7dB across the operating temperature range of -30°C to +85°C. The component utilizes surface mount technology with a 0805 (2012 metric) package containing six printed circuit board pads. Phase balance is maintained at 180° ±10°, while amplitude balance remains within 2.0dB. Voltage Standing Wave Ratio (VSWR) does not exceed 2.0 at both unbalanced and balanced ports. Attenuation specifications include minimum values of 25dB at 880-960MHz, 15dB at 1710-1990MHz, and 15dB at 1990-2170MHz.
Verify current availability status as the component may be marked as obsolete or not recommended for new designs. Confirm RoHS compliance details through official documentation. Check for specific packaging requirements such as reel or cut tape options. Ensure compatibility with existing design constraints before procurement. Review manufacturer notices regarding lifecycle changes and potential supply limitations.
Evaluate the component's suitability for 2.4GHz to 2.5GHz operations. Consider the 0805 package size for space-constrained layouts. Assess thermal performance within the specified operating temperature range. Verify impedance matching requirements for both balanced and unbalanced interfaces. Compare insertion loss characteristics against system sensitivity thresholds.
This balun belongs to the FI series from Taiyo Yuden, designed for multilayer ceramic construction. It serves as a passive signal conditioning element in high-frequency circuits. The product line supports various wireless standards requiring precise impedance transformation. Manufacturing processes utilize advanced ceramic materials for stable electrical performance.
Public confirmed substitute part numbers are not available in the provided documentation.
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