FL450K0000S111

Overview

The TGS FL450K0000S111 is a ceramic filter designed for AM radio applications with a center frequency of 450kHz. It features a bandwidth of 30 kHz and an impedance of 1kOhm. The component utilizes a 3-SMD, J-Lead package configuration. This device serves as a specialized intermediate frequency filter for signal processing in communication systems requiring precise frequency selection.

Feature Summary

• Designed specifically for AM broadcast band filtering applications
• Utilizes ceramic resonator technology for stable frequency response
• Features surface-mount J-lead packaging for automated assembly

Applications

• AM radio receiver intermediate frequency stages
• Communication equipment signal filtering
• Consumer electronics audio processing circuits

Procurement Notes

Verify the specific datasheet revision (e.g., R1010) against your design requirements. Confirm that the 1kOhm impedance and 30 kHz bandwidth align with your circuit topology. Ensure compatibility with the 3-SMD J-Lead footprint during PCB layout validation before finalizing procurement orders.

Selection Notes

Select this component when a 450kHz center frequency with 30 kHz bandwidth is required for AM applications. The 1kOhm impedance rating must match the surrounding circuit design. The SMD J-Lead package is suitable for surface-mount assembly processes. Verify mechanical dimensions against the official specification sheet to ensure proper board space allocation.

Part Context

This part belongs to the TGS ceramic filter family, which provides standardized solutions for radio frequency applications. The FL450K series is commonly used in consumer electronics and communication devices. These filters offer reliable performance for intermediate frequency stages in analog radio receivers.

Replacement Considerations

Cross-reference with TGS part numbers such as FL450K0000S004 or FL450K0000S114 for potential substitutes. Verify that alternative parts maintain identical center frequency, bandwidth, and impedance specifications. Check package compatibility to ensure direct replacement without PCB redesign.