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FLXC2004G-30 is listed in the Memory IC range at ChipApex. The manufacturer field lists Lexar Enterprise. Its product description is 32GB LPDDR4/4X X32 -25C +85C 373. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FLXC2004G-30
- Description：32GB LPDDR4/4X X32 -25C +85C 373
- Series：-
- Mfr：Lexar Enterprise
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR4X
- Memory Size：4GByte (DRAM)
- Memory Organization：1G x 32
- Memory Interface：LPDDR4X
- Clock Frequency：1866 MHz
- Write Cycle Time - Word, Page：535ps
- Voltage - Supply：0.6V, 1.1V
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for FLXC2004G-30
Memory IC Overview
The FLXC2004G-30 is a 4Gb LPDDR4x memory component manufactured by Longsys under the FORESEE brand. It operates at a bus width of x32 and supports voltages of 1.8V, 1.1V, and 1.1V or 0.6V. The device functions within a commercial temperature range of -25°C to 85°C. It utilizes an FBGA200 package with dimensions of 10mm by 14.5mm by 1.0mm. The product is currently in mass production status.
Memory IC Feature Summary
- Integrates LPDDR4x technology to enhance system performance while reducing power consumption for portable devices.
- Supports multiple voltage levels including 1.8V, 1.1V, and 0.6V to accommodate diverse platform requirements.
- Designed to improve usage efficiency and reduce overall system costs through optimized memory architecture.
Memory IC Applications
- Smartphones
- Tablets
- Set-top boxes (STBs)
- Smart TVs
- Dash cams
Memory IC Procurement Notes
Verify that the specific ordering suffix matches the required voltage configuration and package variant. Confirm compatibility with the target SoC platform's electrical specifications. Ensure the procurement channel provides genuine components from Longsys or authorized distributors to guarantee quality and reliability standards are met.
Memory IC Selection Notes
Select this component for applications requiring compact form factors and low power consumption. The FBGA200 package offers space-saving benefits for dense PCB layouts. Consider the supported voltage options when designing power delivery networks. This part is suitable for consumer electronics where performance and energy efficiency are prioritized.
Memory IC Part Context
This component belongs to the FORESEE embedded storage and mobile memory product line established in 2011. FORESEE specializes in industrial and consumer storage solutions, collaborating with major chip platform suppliers. The LPDDR4x series is designed to meet the demands of modern smart devices, offering high density and reliability.
Memory IC Replacement Considerations
Consult official Longsys documentation for verified substitute part numbers. Cross-reference pinouts and electrical characteristics before substitution. Ensure any replacement maintains compatibility with the existing system design and application requirements.
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