FM16G0EMCV3RBFI

$12.01

Description：INDUSTRIAL TEMP. -40C TO +85C 11
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray

SKU:0d4f0e811ee9 Category: Memory IC Brand: ATP Electronics, Inc.

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Product introduction

FM16G0EMCV3RBFI is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is INDUSTRIAL TEMP. -40C TO +85C 11. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FM16G0EMCV3RBFI

Description：INDUSTRIAL TEMP. -40C TO +85C 11
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray
Memory Type：-
Memory Format：-
Technology：-
Memory Size：-
Memory Organization：-
Memory Interface：-
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FM16G0EMCV3RBFI

FM16G0EMCV3RBFI

Memory IC Overview

The FM16G0EMCV3RBFI is a 16 GB embedded MultiMediaCard (eMMC) from the ATP Electronics E600Si series. It utilizes MLC NAND flash memory and operates on the eMMC 5.1 interface within an FBGA-153 package measuring 11.5 mm x 13 mm x 1 mm. Designed for industrial applications, it supports a wide operating temperature range of -40°C to +85°C. The component features SMD/SMT mounting and delivers sequential read speeds up to 230 MB/s and write speeds up to 100 MB/s.

Memory IC Feature Summary

Industrial-grade reliability with extended temperature tolerance
MLC NAND flash configuration for balanced endurance
Compliant with eMMC 5.1 standard specifications

Memory IC Applications

Industrial automation systems
Embedded computing platforms
Automotive infotainment units

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to +85°C), distinct from commercial variants. Confirm RoHS compliance status via the official datasheet before integration. Ensure the FBGA-153 footprint matches the target PCB layout. Validate that the eMMC 5.1 controller compatibility aligns with the host system requirements.

Memory IC Selection Notes

Select this model when industrial thermal stability is required alongside moderate storage capacity. The MLC configuration offers a balance between cost and endurance suitable for general-purpose industrial logging. Compare against the commercial E600Sc series if lower temperatures are acceptable. Ensure the host interface supports the required bandwidth for sequential operations.

Memory IC Part Context

This component belongs to the E600Si series, which targets robust industrial environments. It shares the physical dimensions and interface protocol with other models in the family but differs in temperature grading and NAND type. The FBGA-153 package ensures compatibility with standard surface-mount assembly processes used in compact electronic devices.