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FM8G00EMCV3RBFI is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is INDUSTRIAL TEMP. -40C TO +85C 11. Review the specifications below when checking this part for your BOM.
Memory IC specifications for FM8G00EMCV3RBFI
- Description：INDUSTRIAL TEMP. -40C TO +85C 11
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
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Memory IC datasheet and documents for FM8G00EMCV3RBFI
Memory IC Overview
The FM8G00EMCV3RBFI is an industrial-grade embedded MultiMediaCard (eMMC) manufactured by ATP Electronics. It utilizes MLC NAND flash technology and operates within a temperature range of -40°C to +85°C. The component features a 11.5x13 mm form factor and is housed in an FBGA-153 package designed for surface mount installation.
Memory IC Feature Summary
- Industrial temperature rating for extreme environments
- MLC NAND flash configuration
- Compact 11.5x13 mm footprint
Memory IC Applications
- Industrial automation systems
- Embedded storage solutions requiring wide temperature tolerance
- Ruggedized electronic devices
Memory IC Procurement Notes
Verify current supply status as distribution may be restricted. Confirm RoHS compliance details through official manufacturer channels before integration. Ensure the FBGA-153 package aligns with PCB design specifications.
Memory IC Selection Notes
Select this component when industrial temperature stability and compact dimensions are required. The MLC configuration offers a balance of endurance and capacity suitable for demanding embedded applications.
Memory IC Part Context
This eMMC belongs to the E600Si series from ATP Electronics, targeting robust data storage needs in harsh operating conditions.
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